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FP10R12W1T4B3BOMA1

Infineon Technologies

FP10R12W1T4B3BOMA1 by Infineon Technologies

Infineon Technologies' FP10R12W1T4B3BOMA1 is a N-CHANNEL IGBT with 6 elements in a bridge configuration. It has a max VCE of 1200V, IC of 20A, and toff of 500ns. Ideal for power control applications due to its built-in diode and thermistor, it offers fast ton at 108ns.

Median Price

$32.250

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 24 parts In-Stock

1+ parts

$22.750

100+ parts

-

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-

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24

$22.750

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DigiKey

USA . 16 parts In-Stock

1+ parts

$32.250

100+ parts

$21.610

1k+ parts

$20.683

10k+ parts

-

16

$32.250

$21.610

$20.683

-

Chip1Stop

Japan . 24 parts In-Stock

1+ parts

$32.700

100+ parts

$28.500

1k+ parts

$27.300

10k+ parts

-

24

$32.700

$28.500

$27.300

-

RS (Exports)

UK . 21 parts In-Stock

1+ parts

$46.006

100+ parts

$38.334

1k+ parts

$35.389

10k+ parts

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21

$46.006

$38.334

$35.389

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Rochester

USA . 29 parts In-Stock

1+ parts

-

100+ parts

$20.690

1k+ parts

$18.510

10k+ parts

$17.420

29

-

$20.690

$18.510

$17.420

Verical

USA . 24 parts In-Stock

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24

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Digiode

USA . 133 parts In-Stock

1+ parts

$21.612

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-

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133

$21.612

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$33.010

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-

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50

$33.010

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$40.440

100+ parts

$36.550

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100

$40.440

$36.550

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Vyrian

USA . 3,161 parts In-Stock

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3,161

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 6,749 parts In-Stock

1+ parts

$1.562

100+ parts

$1.500

1k+ parts

$1.437

10k+ parts

-

6,749

$1.562

$1.500

$1.437

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Aztec Data Supply Inc.

USA . 1,718 parts In-Stock

1+ parts

$1.943

100+ parts

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1,718

$1.943

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Corohmni

South Africa . 130 parts In-Stock

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$1.945

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130

$1.945

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AZTECH Wire

Italy . 802 parts In-Stock

1+ parts

$12.548

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802

$12.548

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Semicontronic

India . 17 parts In-Stock

1+ parts

$19.340

100+ parts

$18.856

1k+ parts

$18.760

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17

$19.340

$18.856

$18.760

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Corphita

USA . 922 parts In-Stock

1+ parts

$20.475

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922

$20.475

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Continental Prestige Electronics

USA . 7 parts In-Stock

1+ parts

$28.850

100+ parts

$27.440

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7

$28.850

$27.440

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Ampacity Inc.

Singapore . 17 parts In-Stock

1+ parts

$42.090

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17

$42.090

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Microchip USA

USA . 5,583 parts In-Stock

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$100.556

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5,583

$100.556

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QUARKTWIN TECHNOLOGY LTD

USA . 19,623 parts In-Stock

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19,623

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Argo Parts USA

USA . 2,254 parts In-Stock

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2,254

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Overview

Elevate your power control capabilities with the FP10R12W1T4B3BOMA1 by Infineon Technologies. As a leader in insulated gate bipolar transistors, Infineon delivers top-quality products that excel in performance and reliability. This N-CHANNEL transistor offers a unique configuration with built-in diode and thermistor, making it ideal for a wide range of power control applications. With its fast turn on/off times and high collector-emitter voltage, this product provides exceptional value and benefits to customers looking to optimize their power management systems. Upgrade to the FP10R12W1T4B3BOMA1 today and experience the difference Infineon can make for your applications.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally offer lower on-state voltage drop and higher efficiency compared to P-channel, making this product a good choice for power control applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The bridge configuration with built-in diode and thermistor simplifies the design and integration process, providing additional functionality and protection in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for handling high-power loads with efficiency and reliability.

Nominal Turn Off Time (toff): 500 ns

The fast turn off time allows for precise control and switching of power, reducing losses and improving overall performance in power control applications.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum voltage rating makes this IGBT suitable for high voltage applications, providing a wide range of flexibility in power control designs.

Maximum Collector Current (IC): 20 A

With a maximum collector current of 20 A, this IGBT can handle high levels of current in power control applications, ensuring stable and reliable operation.

Nominal Turn On Time (ton): 108 ns

The fast turn on time allows for quick and efficient switching of power, improving responsiveness and control in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP10R12W1T4B3BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X21

No. of Elements:

6

No. of Terminals:

21

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

500 ns

Nominal Turn On Time (ton):

108 ns

Trade Compliance

FP10R12W1T4B3BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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