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FP10R12W1T4PBPSA1

Infineon Technologies

FP10R12W1T4PBPSA1 by Infineon Technologies

Infineon Technologies' FP10R12W1T4PBPSA1 is an N-CHANNEL IGBT with 7 elements, max. collector-emitter voltage of 1200V, and max. collector current of 20A. It has a nominal turn off time of 500ns and turn on time of 108ns, ideal for power control applications at up to 175°C operating temperature.

Median Price

$31.337

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 35 parts In-Stock

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$39.280

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$28.460

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$28.460

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Rochester

USA . 540 parts In-Stock

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$25.070

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$22.430

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$21.110

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$22.430

$21.110

DigiKey

USA . 505 parts In-Stock

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Verical

USA . 406 parts In-Stock

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$31.337

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$28.038

10k+ parts

$26.387

406

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$31.337

$28.038

$26.387

Distributors (In-Stock)

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Digiode

USA . 784 parts In-Stock

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$30.048

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Vyrian

USA . 8,106 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 149 parts In-Stock

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$1.270

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149

$1.270

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Corohmni

South Africa . 853 parts In-Stock

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$1.654

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853

$1.654

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Modulus Dynamics

Lithuania . 2,814 parts In-Stock

1+ parts

$1.819

100+ parts

$1.746

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$1.673

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2,814

$1.819

$1.746

$1.673

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Semicontronic

India . 333 parts In-Stock

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$26.890

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$26.218

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$26.083

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333

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Ampacity Inc.

Singapore . 184 parts In-Stock

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$26.890

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Corphita

USA . 296 parts In-Stock

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$28.467

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Microchip USA

USA . 2,339 parts In-Stock

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$112.056

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QUARKTWIN TECHNOLOGY LTD

USA . 20,702 parts In-Stock

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Continental Prestige Electronics

USA . 4,428 parts In-Stock

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Argo Parts USA

USA . 2,280 parts In-Stock

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Perfect Parts

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your power control capabilities with the Infineon Technologies FP10R12W1T4PBPSA1 Insulated Gate Bipolar Transistor (IGBT). As a leader in semiconductor manufacturing, Infineon Technologies ensures top-notch quality and reliability in all its products. With applications in various industries, this N-CHANNEL transistor offers exceptional performance and efficiency. Its complex configuration and fast turn-on/off times make it ideal for high-power applications. Experience the value of superior power control with the FP10R12W1T4PBPSA1 by Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer lower ON-state voltage drop and higher efficiency, making them a good choice for power control applications.

Configuration: COMPLEX

Complex configuration allows for more flexibility and control in power control applications, making this IGBT versatile and suitable for various uses.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, providing efficient and reliable performance in controlling power circuits.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into power control systems, saving space and providing a neat and organized setup.

Nominal Turn Off Time (toff): 500 ns

Fast turn-off time ensures quick response and efficient switching, reducing power losses and improving overall performance.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for operation in high voltage applications, making this IGBT suitable for a wide range of power control scenarios.

Maximum Collector Current (IC): 20 A

High collector current rating enables handling of large currents, making this IGBT ideal for power control applications requiring high current capabilities.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP10R12W1T4PBPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

500 ns

Nominal Turn On Time (ton):

108 ns

Trade Compliance

FP10R12W1T4PBPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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