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FGB20N60SFD-F085

Onsemi

FGB20N60SFD-F085 by Onsemi

FGB20N60SFD-F085 by Onsemi is an N-CHANNEL IGBT with 600V VCE, 40A IC, and 208W Ptot. Ideal for power control applications due to its fast tr of 21ns and tf of 43ns. AEC-Q101 certified for automotive use, it features a small outline package style.

Median Price

$4.900

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,426 parts In-Stock

1+ parts

$4.900

100+ parts

$2.320

1k+ parts

$2.130

10k+ parts

$2.040

1,426

$4.900

$2.320

$2.130

$2.040

DigiKey

USA . 716 parts In-Stock

1+ parts

$4.900

100+ parts

$2.310

1k+ parts

$1.822

10k+ parts

$1.780

716

$4.900

$2.310

$1.822

$1.780

Newark

USA . 2,426 parts In-Stock

1+ parts

$5.710

100+ parts

$3.130

1k+ parts

$2.850

10k+ parts

-

2,426

$5.710

$3.130

$2.850

-

Element14

Singapore . 1,636 parts In-Stock

1+ parts

$7.100

100+ parts

$3.350

1k+ parts

$2.620

10k+ parts

-

1,636

$7.100

$3.350

$2.620

-

Farnell

UK . 1,636 parts In-Stock

1+ parts

-

100+ parts

$1.960

1k+ parts

$1.560

10k+ parts

-

1,636

-

$1.960

$1.560

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EBV Elektronik

Germany . 800 parts In-Stock

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800

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Distributors (In-Stock)

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Digiode

USA . 605 parts In-Stock

1+ parts

$1.938

100+ parts

-

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-

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605

$1.938

-

-

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Nova Conductors

Japan . 115 parts In-Stock

1+ parts

$2.302

100+ parts

-

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115

$2.302

-

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Flip Electronics

USA . 3,200 parts In-Stock

1+ parts

-

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3,200

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Vyrian

USA . 1,407 parts In-Stock

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1,407

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,090 parts In-Stock

1+ parts

$1.730

100+ parts

-

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-

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4,090

$1.730

-

-

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Corphita

USA . 1,578 parts In-Stock

1+ parts

$1.836

100+ parts

-

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1,578

$1.836

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Corohmni

South Africa . 311 parts In-Stock

1+ parts

$2.040

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-

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311

$2.040

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Argo Parts USA

USA . 8,613 parts In-Stock

1+ parts

$2.302

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8,613

$2.302

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Continental Prestige Electronics

USA . 5,843 parts In-Stock

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$2.302

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$2.256

5,843

$2.302

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$2.256

Netroflash

USA . 200 parts In-Stock

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$2.302

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-

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200

$2.302

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Microchip USA

USA . 8,094 parts In-Stock

1+ parts

$16.285

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8,094

$16.285

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iodParts Technologies Inc.

India . 10,016 parts In-Stock

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Kulean Microsystems

USA . 7,130 parts In-Stock

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7,130

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Kepictronics

USA . 5,600 parts In-Stock

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5,600

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Problanco Electronics

Mexico . 4,027 parts In-Stock

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Lixinc

USA . 3,167 parts In-Stock

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Supply Digital

USA . 2,302 parts In-Stock

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2,302

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TANS Electronics

Latvia . 1,574 parts In-Stock

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1,574

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Andel Nordic

Denmark . 1,227 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 896 parts In-Stock

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SupplyDigital Components

Austria . 822 parts In-Stock

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822

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UHIMA Technologies

Türkiye . 83 parts In-Stock

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Overview

Enhance your power control applications with the FGB20N60SFD-F085 IGBT by Onsemi. Designed with precision and reliability in mind, this N-CHANNEL transistor offers a single configuration with a built-in diode for seamless operation. Experience maximum power dissipation of 208 W and a collector-emitter voltage of 600 V, making it an ideal choice for high-performance systems. With a package style that is both compact and durable, this IGBT ensures efficient power management without compromising on quality. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations. Elevate your projects today with the FGB20N60SFD-F085!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package provides durability and protection, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for efficient power control and high performance in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances the functionality of the transistor for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimized performance and reliability.

Surface Mount: YES

The surface mount feature provides easy installation and space-saving design for compact electronic systems.

Maximum Rise Time (tr): 21 ns

The fast rise time enables quick response and high switching speeds in power control operations.

Package Shape: RECTANGULAR

The rectangular shape offers compatibility with standard mounting techniques and easy integration into electronic systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates secure connections and efficient heat dissipation for sustained performance.

Maximum Fall Time (tf): 43 ns

The short fall time allows for rapid turn-off and minimizes power loss during switching transitions.

Nominal Turn Off Time (toff): 123 ns

The nominal turn off time ensures precise control and efficient operation in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGB20N60SFD-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

43 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Maximum Rise Time (tr):

21 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

123 ns

Nominal Turn On Time (ton):

28 ns

Trade Compliance

FGB20N60SFD-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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