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FGH60N60UFDTU

Onsemi

FGH60N60UFDTU by Onsemi

FGH60N60UFDTU by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 600V and a max collector current of 120A. It has a nominal turn-off time of 204ns, making it ideal for power control applications requiring high-speed switching capabilities. The transistor's package style is flange mount with through-hole terminals, suitable for applications where efficient heat dissipation is crucial.

Median Price

$5.098

Lifecycle Status

EOL

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7

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1k+

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Arrow

USA . 37 parts In-Stock

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$5.098

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$4.462

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$3.888

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$3.558

37

$5.098

$4.462

$3.888

$3.558

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Nova Conductors

Japan . 50 parts In-Stock

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$4.610

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$4.610

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Digiode

USA . 189 parts In-Stock

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$4.843

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Vyrian

USA . 7,285 parts In-Stock

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Chip Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Aztec Data Supply Inc.

USA . 1,689 parts In-Stock

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$1.641

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$1.641

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Corohmni

South Africa . 244 parts In-Stock

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$4.427

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Aranea Global

USA . 500 parts In-Stock

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$4.518

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$4.337

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$4.518

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$4.337

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Corphita

USA . 2,234 parts In-Stock

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$4.588

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Continental Prestige Electronics

USA . 2,827 parts In-Stock

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$4.610

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$4.518

2,827

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Ampacity Inc.

Singapore . 37 parts In-Stock

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$9.430

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37

$9.430

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Andel Nordic

Denmark . 4,354 parts In-Stock

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$10.231

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$9.822

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$9.822

4,354

$10.231

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$9.822

$9.822

AZTECH Wire

Italy . 603 parts In-Stock

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$18.749

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QUARKTWIN TECHNOLOGY LTD

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RC Electronics

USA . 9,692 parts In-Stock

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$4.810

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$4.390

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$4.260

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$4.260

Kulean Microsystems

USA . 7,899 parts In-Stock

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Futuretech Components

Singapore . 7,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,753 parts In-Stock

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Kepictronics

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Problanco Electronics

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Alle Elektronik GmbH

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SupplyDigital Components

Austria . 4,138 parts In-Stock

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Lixinc

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Supply Digital

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Argo Parts USA

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TANS Electronics

Latvia . 941 parts In-Stock

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 495 parts In-Stock

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Overview

Unleash the power of FGH60N60UFDTU by Onsemi, a top-tier Insulated Gate Bipolar Transistor that guarantees superior quality and performance. Manufactured by Onsemi, a trusted industry leader, this N-CHANNEL transistor is ideal for power control applications. With a maximum collector-emitter voltage of 600V and a maximum power dissipation of 298W, this transistor offers unmatched reliability and efficiency. Say goodbye to overheating issues with a maximum operating temperature of 150°C. Upgrade your power control systems with FGH60N60UFDTU and experience seamless performance like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good insulation, making the IGBT suitable for various applications and environments.

Maximum Collector-Emitter Voltage: 600 V

This high voltage rating allows the IGBT to handle power control applications that require higher voltage levels.

Maximum Power Dissipation (Abs): 298 W

The high power dissipation capability ensures that the IGBT can handle significant power loads without overheating.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can save space in the overall system.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage ensures proper gate control for efficient power switching operations.

Maximum Collector Current (IC): 120 A

With a high collector current rating, the IGBT can handle large currents for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH60N60UFDTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

80 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

204 ns

Nominal Turn On Time (ton):

83 ns

Trade Compliance

FGH60N60UFDTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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