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FS200R07N3E4RBOSA1

Infineon Technologies

FS200R07N3E4RBOSA1 by Infineon Technologies

FS200R07N3E4RBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 6 elements, 650V max collector-emitter voltage, and 210ns turn on time. It is used for power control applications due to its complex configuration and flange mount package style.

Median Price

$147.257

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 10 parts In-Stock

1+ parts

$67.360

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10

$67.360

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DigiKey

USA . 145 parts In-Stock

1+ parts

$106.730

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145

$106.730

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Verical

USA . 10 parts In-Stock

1+ parts

$187.784

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10

$187.784

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Chip1Stop

Japan . 10 parts In-Stock

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$192.000

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10

$192.000

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Digiode

USA . 903 parts In-Stock

1+ parts

$139.774

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903

$139.774

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Nova Conductors

Japan . 600 parts In-Stock

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$261.730

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600

$261.730

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Vyrian

USA . 4,216 parts In-Stock

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4,216

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 11,692 parts In-Stock

1+ parts

$0.595

100+ parts

$0.571

1k+ parts

$0.547

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-

11,692

$0.595

$0.571

$0.547

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Corohmni

South Africa . 325 parts In-Stock

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$0.856

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325

$0.856

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Aztec Data Supply Inc.

USA . 335 parts In-Stock

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$1.730

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335

$1.730

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AZTECH Wire

Italy . 594 parts In-Stock

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$14.788

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$14.788

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Ampacity Inc.

Singapore . 21 parts In-Stock

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$125.060

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$125.060

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Corphita

USA . 930 parts In-Stock

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$132.417

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930

$132.417

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Continental Prestige Electronics

USA . 744 parts In-Stock

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$261.730

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$256.495

744

$261.730

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$256.495

Microchip USA

USA . 6,451 parts In-Stock

1+ parts

$392.640

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6,451

$392.640

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,908 parts In-Stock

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2,908

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Overview

Unleash the power of innovation with the FS200R07N3E4RBOSA1 by Infineon Technologies. This Insulated Gate Bipolar Transistor (IGBT) offers exceptional quality and reliability, setting a new standard in power control applications. With its N-CHANNEL polarity, complex configuration, and rapid response times, this transistor is perfect for demanding tasks where precision and efficiency are crucial. Experience seamless integration with its 35 terminals and superior performance with a maximum collector-emitter voltage of 650V. Trust Infineon Technologies to deliver cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower conduction losses and higher current ratings compared to P-CHANNEL, making it a better choice for power control applications.

Configuration: COMPLEX

Complex configuration allows for better optimization and control of power flow, making this IGBT suitable for complex power control systems.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring efficient and reliable performance in controlling power flow and voltage levels.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact design for easy installation and integration into power control circuits.

Nominal Turn Off Time (toff): 450 ns

Fast turn-off time of 450 ns allows for quick switching and control of power, reducing switching losses and improving overall efficiency.

No. of Terminals: 35

Higher number of terminals provide more flexibility in connecting the IGBT to external circuits and components, enabling versatile applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure and stable mounting options, ensuring safe and reliable operation in various environments.

Maximum Collector-Emitter Voltage: 650 V

High maximum collector-emitter voltage of 650 V allows for handling high voltage levels, making it suitable for power control in industrial applications.

Transistor Element Material: SILICON

Silicon material provides high thermal conductivity and improved power dissipation, enhancing the overall performance and reliability of the IGBT.

Terminal Position: UPPER

Upper terminal position facilitates easy integration with other components and circuitry, simplifying the overall design and installation process.

Nominal Turn On Time (ton): 210 ns

Fast turn-on time of 210 ns enables quick response and control of power flow, improving efficiency and performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS200R07N3E4RBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector-Emitter Voltage:

650 V

Configuration:

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

450 ns

Nominal Turn On Time (ton):

210 ns

Trade Compliance

FS200R07N3E4RBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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