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FS200R12KT4RB11BOSA1

Infineon Technologies

FS200R12KT4RB11BOSA1 by Infineon Technologies

Infineon's FS200R12KT4RB11BOSA1 is a N-CHANNEL IGBT with 6 elements, built-in diode, and thermistor. It has a max voltage of 1200V and max current of 280A for power control applications. UL approved, it features a turn off time of 600ns and turn on time of 190ns in a flange mount package.

Median Price

$226.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 48 parts In-Stock

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$125.020

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48

$125.020

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Element14

Singapore . 10 parts In-Stock

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$327.420

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10

$327.420

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Digiode

USA . 102 parts In-Stock

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$132.259

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102

$132.259

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Nova Conductors

Japan . 300 parts In-Stock

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$336.400

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Vyrian

USA . 2,486 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 12,467 parts In-Stock

1+ parts

$0.731

100+ parts

$0.702

1k+ parts

$0.673

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-

12,467

$0.731

$0.702

$0.673

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Aztec Data Supply Inc.

USA . 2,051 parts In-Stock

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$1.570

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2,051

$1.570

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Corohmni

South Africa . 12 parts In-Stock

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$1.703

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12

$1.703

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AZTECH Wire

Italy . 452 parts In-Stock

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$17.146

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452

$17.146

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Ampacity Inc.

Singapore . 13 parts In-Stock

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$118.340

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13

$118.340

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Semicontronic

India . 13 parts In-Stock

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$118.340

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$115.382

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$114.790

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13

$118.340

$115.382

$114.790

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Corphita

USA . 118 parts In-Stock

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$125.298

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118

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Continental Prestige Electronics

USA . 2,617 parts In-Stock

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$336.400

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$329.672

2,617

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$329.672

Microchip USA

USA . 3,997 parts In-Stock

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$504.660

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$504.660

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Argo Parts USA

USA . 2,133 parts In-Stock

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2,133

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Netroflash

USA . 1,000 parts In-Stock

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$329.672

1k+ parts

$319.580

10k+ parts

$312.852

1,000

-

$329.672

$319.580

$312.852

Perfect Parts

USA . 45 parts In-Stock

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Overview

Elevate your power control capabilities with the FS200R12KT4RB11BOSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor configuration, featuring a bridge design with 6 elements, built-in diode, and thermistor, is perfect for a wide range of applications. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 280A, this transistor offers unmatched performance and efficiency. Trust Infineon to deliver cutting-edge technology that meets UL standards, providing you with the value and benefits you need for your power control needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their superior performance and efficiency compared to P-channel IGBTs, making this product a good choice for power control applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor enhance the functionality and protection of the IGBT, making it a convenient and reliable choice for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient and reliable performance in controlling power circuits.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum voltage rating, this IGBT is suitable for high voltage applications, providing robust performance and reliability in challenging environments.

Maximum Collector Current (IC): 280 A

The high maximum collector current rating allows this IGBT to handle large amounts of current, making it ideal for power control applications that require high current handling capabilities.

Nominal Turn On Time (ton): 190 ns

The fast turn-on time of 190 ns ensures quick response and switching speeds, making this IGBT suitable for applications that require rapid switching and precise control.

Reference Standard: UL APPROVED

Being UL approved indicates that this IGBT meets industry safety and quality standards, providing peace of mind and assurance of reliability in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS200R12KT4RB11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

600 ns

Nominal Turn On Time (ton):

190 ns

Trade Compliance

FS200R12KT4RB11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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