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FD16001200R17HP4B2BOSA2

Infineon Technologies

FD16001200R17HP4B2BOSA2 by Infineon Technologies

Infineon's FD16001200R17HP4B2BOSA2 IGBT features N-CHANNEL polarity, COMPLEX configuration, and 1700V max. collector-emitter voltage. Ideal for POWER CONTROL applications with 1710ns turn-off time and 650ns turn-on time. Package style is FLANGE MOUNT with 9 terminals in RECTANGULAR shape.

Median Price

$1,211.344

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 93 parts In-Stock

1+ parts

$1,076.750

100+ parts

$1,012.150

1k+ parts

$947.540

10k+ parts

-

93

$1,076.750

$1,012.150

$947.540

-

Verical

USA . 93 parts In-Stock

1+ parts

$1,345.938

100+ parts

$1,265.188

1k+ parts

$1,184.425

10k+ parts

-

93

$1,345.938

$1,265.188

$1,184.425

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 181 parts In-Stock

1+ parts

$1,489.628

100+ parts

-

1k+ parts

-

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181

$1,489.628

-

-

-

Vyrian

USA . 7,688 parts In-Stock

1+ parts

-

100+ parts

-

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-

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7,688

-

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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-

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-

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10

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 13 parts In-Stock

1+ parts

$1.127

100+ parts

-

1k+ parts

-

10k+ parts

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13

$1.127

-

-

-

Aztec Data Supply Inc.

USA . 30,177 parts In-Stock

1+ parts

$1.520

100+ parts

-

1k+ parts

-

10k+ parts

-

30,177

$1.520

-

-

-

Modulus Dynamics

Lithuania . 6,986 parts In-Stock

1+ parts

$1.767

100+ parts

$1.696

1k+ parts

$1.626

10k+ parts

-

6,986

$1.767

$1.696

$1.626

-

AZTECH Wire

Italy . 526 parts In-Stock

1+ parts

$19.175

100+ parts

-

1k+ parts

-

10k+ parts

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526

$19.175

-

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Semicontronic

India . 93 parts In-Stock

1+ parts

$1,332.830

100+ parts

$1,299.509

1k+ parts

$1,292.845

10k+ parts

-

93

$1,332.830

$1,299.509

$1,292.845

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Corphita

USA . 162 parts In-Stock

1+ parts

$1,411.227

100+ parts

-

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-

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162

$1,411.227

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-

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Microchip USA

USA . 2,530 parts In-Stock

1+ parts

$1,976.220

100+ parts

-

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-

10k+ parts

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2,530

$1,976.220

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-

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Ampacity Inc.

Singapore . 93 parts In-Stock

1+ parts

$2,900.860

100+ parts

-

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-

10k+ parts

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93

$2,900.860

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Continental Prestige Electronics

USA . 4,515 parts In-Stock

1+ parts

-

100+ parts

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4,515

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Argo Parts USA

USA . 3,285 parts In-Stock

1+ parts

-

100+ parts

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3,285

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Revolutionize your power control applications with the FD16001200R17HP4B2BOSA2 by Infineon Technologies. As a leader in the industry, Infineon Technologies ensures top-notch quality and performance in every product they create. The Insulated Gate Bipolar Transistor (IGBT) category offers unparalleled reliability and efficiency, making it the ideal choice for various industrial and commercial uses. With its N-CHANNEL polarity, complex configuration, and high maximum collector-emitter voltage of 1700 V, this transistor guarantees seamless power control operations. Upgrade your systems today with the FD16001200R17HP4B2BOSA2 for enhanced performance and peace of mind.

Feature Benefit Bullets

Polarity or Channel Type

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration

Complex configuration allows for precise control over power applications, making this IGBT suitable for a wide range of power control tasks.

Transistor Application

Specifically designed for power control applications, this IGBT delivers high performance and reliability in controlling power flow.

Package Shape

Rectangular package shape ensures easy mounting and handling, making it convenient for installations in various power control systems.

No. of Elements

Having two elements provides redundancy and helps in maintaining stable operation in power control applications.

Nominal Turn Off Time (toff)

The fast turn-off time of 1710 ns ensures efficient switching and minimal power loss during operation, making this IGBT suitable for high-power applications.

No. of Terminals

With 9 terminals, this IGBT offers versatile connectivity options for integrating into various power control circuits.

Package Style (Meter)

Flange mount package style provides secure and stable mounting, ensuring reliability in demanding power control environments.

Maximum Collector-Emitter Voltage

With a high maximum collector-emitter voltage of 1700 V, this IGBT can handle high power levels with ease, making it suitable for demanding power control tasks.

Transistor Element Material

Silicon-based transistor element material offers excellent performance and reliability in power control applications, making this IGBT a durable choice for long-term use.

Terminal Position

Upper terminal position ensures easy connectivity and efficient heat dissipation, contributing to the overall reliability and performance of this IGBT.

Case Connection

Isolated case connection enhances safety and prevents electrical interference, making this IGBT a reliable choice for critical power control systems.

Nominal Turn On Time (ton)

The fast turn-on time of 650 ns ensures quick response and precise control in power switching applications, enhancing the efficiency and performance of this IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FD16001200R17HP4B2BOSA2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1700 V

Configuration:

JESD-30 Code:

R-XUFM-X9

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

9

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1710 ns

Nominal Turn On Time (ton):

650 ns

Trade Compliance

FD16001200R17HP4B2BOSA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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