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IRGR4045DPBF

Infineon Technologies

IRGR4045DPBF by Infineon Technologies

IRGR4045DPBF by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 600V and Max Power Dissipation of 77W. It has a single configuration with built-in diode, ideal for power control applications requiring fast switching times (tr: 15ns, tf: 22ns). This surface-mount transistor operates at temperatures up to 175°C.

Median Price

$1.180

Lifecycle Status

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12

In-Stock Inventory

1k+

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Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$1.871

100+ parts

$1.703

1k+ parts

$1.534

10k+ parts

-

5,000

$1.871

$1.703

$1.534

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Rochester

USA . 1,277 parts In-Stock

1+ parts

-

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$1.030

1k+ parts

$0.855

10k+ parts

$0.762

1,277

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$1.030

$0.855

$0.762

DigiKey

USA . 1,277 parts In-Stock

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-

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$1.290

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1,277

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$1.290

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Verical

USA . 1,277 parts In-Stock

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$1.069

10k+ parts

$0.953

1,277

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$1.069

$0.953

Distributors (In-Stock)

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Digiode

USA . 569 parts In-Stock

1+ parts

$0.805

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569

$0.805

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Vyrian

USA . 2,275 parts In-Stock

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2,275

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Martec Srl

Italy . 1,605 parts In-Stock

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ComSIT Distribution GmbH

Germany . 375 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 255 parts In-Stock

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Euro-Tech

UK . 73 parts In-Stock

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J2 Sourcing AB

Sweden . 13 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,861 parts In-Stock

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$0.613

100+ parts

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1,861

$0.613

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Ampacity Inc.

Singapore . 2,252 parts In-Stock

1+ parts

$0.720

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2,252

$0.720

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Corphita

USA . 976 parts In-Stock

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$0.762

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976

$0.762

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Corohmni

South Africa . 357 parts In-Stock

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$0.768

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357

$0.768

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Modulus Dynamics

Lithuania . 11,970 parts In-Stock

1+ parts

$1.615

100+ parts

$1.550

1k+ parts

$1.486

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11,970

$1.615

$1.550

$1.486

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$1.871

100+ parts

$1.703

1k+ parts

$1.534

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$1.871

$1.703

$1.534

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Microchip USA

USA . 4,364 parts In-Stock

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$5.265

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4,364

$5.265

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Andel Nordic

Denmark . 402 parts In-Stock

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$59.180

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$41.426

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$41.426

402

$59.180

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$41.426

$41.426

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,770 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,111 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,074 parts In-Stock

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Argo Parts USA

USA . 3,570 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

USA . 1,303 parts In-Stock

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Continental Prestige Electronics

USA . 1,282 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Unlock the power of efficient and reliable power control with the Infineon Technologies IRGR4045DPBF Insulated Gate Bipolar Transistor. Manufactured by a trusted industry leader, this N-channel IGBT offers superior performance and durability for a wide range of applications. With a maximum operating temperature of 175°C and a maximum collector-emitter voltage of 600V, this transistor is designed to handle even the most demanding power control tasks. Whether you're looking to optimize energy efficiency or improve system reliability, the IRGR4045DPBF delivers the value, benefits, and advantages you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Power Dissipation (Abs): 77 W

Allows for efficient handling of power and prevents overheating, making it suitable for high-power applications.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltages, making it suitable for a wide range of applications where high voltage operation is required.

Maximum Gate-Emitter Voltage: 20 V

Provides flexibility in controlling the transistor operation, allowing for precise voltage control.

Maximum Collector Current (IC): 12 A

Can handle high current levels, making it suitable for power control applications that require a high current capacity.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGR4045DPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

22 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

15 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

127 ns

Nominal Turn On Time (ton):

38 ns

Trade Compliance

IRGR4045DPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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