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IRGR2B60KDTRPBF

Infineon Technologies

IRGR2B60KDTRPBF by Infineon Technologies

Infineon's IRGR2B60KDTRPBF is an N-CHANNEL IGBT with 600V VCE, 6.3A IC, and 35W power dissipation. Ideal for applications requiring fast switching with a rise time of 25ns and fall time of 75ns, such as motor drives and power supplies.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,159 parts In-Stock

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Digiode

USA . 688 parts In-Stock

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688

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,577 parts In-Stock

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$0.360

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$0.360

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Modulus Dynamics

Lithuania . 12,311 parts In-Stock

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$0.460

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$0.442

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$0.423

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12,311

$0.460

$0.442

$0.423

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Corohmni

South Africa . 452 parts In-Stock

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$0.562

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452

$0.562

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Ampacity Inc.

Singapore . 508 parts In-Stock

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$8.050

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508

$8.050

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AZTECH Wire

Italy . 411 parts In-Stock

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$14.244

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411

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Continental Prestige Electronics

USA . 4,634 parts In-Stock

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Argo Parts USA

USA . 3,496 parts In-Stock

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Corphita

USA . 584 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 138 parts In-Stock

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138

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Overview

Unleash the power of innovation with the IRGR2B60KDTRPBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are designed for superior performance and reliability. Whether you're looking to enhance the efficiency of your power electronics or improve the overall functionality of your applications, this N-CHANNEL IGBT offers unmatched value, benefits, and advantages. Elevate your projects with the IRGR2B60KDTRPBF and experience the difference today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them suitable for power electronics applications.

Surface Mount: YES

Surface mount package makes it easy to mount and solder the IGBT onto a circuit board, saving space and enhancing reliability.

Maximum Rise Time (tr): 25 ns

Fast rise time allows for quick switching between on and off states, reducing power losses and improving overall performance.

Maximum Fall Time (tf): 75 ns

Fast fall time ensures quick turn-off of the IGBT, which is important for power efficiency and preventing overheating.

Maximum Power Dissipation (Abs): 35 W

With a high power dissipation rating, this IGBT can handle high power applications without overheating or getting damaged.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments without performance degradation, suitable for demanding industrial applications.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating allows for use in high voltage circuits, providing flexibility in various power electronics designs.

Maximum Gate-Emitter Voltage: 20 V

Low gate-emitter voltage ensures easy control of the IGBT, enhancing its efficiency and reliability in different circuit configurations.

Maximum Collector Current (IC): 6.3 A

Able to handle high collector current, making it suitable for power switching applications where high currents are involved.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage enables efficient control of the IGBT, ensuring reliable operation in various circuit setups.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGR2B60KDTRPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

75 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

25 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Trade Compliance

IRGR2B60KDTRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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