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IRG4PC40UDPBF

Infineon Technologies

IRG4PC40UDPBF by Infineon Technologies

IRG4PC40UDPBF by Infineon Technologies is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max collector current of 40A. It has a nominal turn-off time of 330ns, making it ideal for power control applications requiring fast switching speeds. The package style is flange mount with a max power dissipation of 160W, suitable for high-power electronic systems.

Median Price

$15.724

Lifecycle Status

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9

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1k+

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Nova Conductors

Japan . 50 parts In-Stock

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$4.343

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Maritex

Poland . 2,185 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,242 parts In-Stock

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Vyrian

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Digiode

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Fibra_Brandt Electronic GMBH

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Inventory MP

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Bristol Electronics

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Aztec Data Supply Inc.

USA . 764 parts In-Stock

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$0.609

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$0.609

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Modulus Dynamics

Lithuania . 5,669 parts In-Stock

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$1.177

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$1.130

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$1.083

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Corohmni

South Africa . 105 parts In-Stock

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$1.635

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Continental Prestige Electronics

USA . 5,926 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 500 parts In-Stock

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$4.126

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$4.039

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$4.039

AZTECH Wire

Italy . 648 parts In-Stock

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$8.749

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Ampacity Inc.

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

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Perfect Parts

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RC Electronics

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A-Z Elektronik GmbH

Germany . 5,178 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

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Alle Elektronik GmbH

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Lixinc

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Corphita

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Amble Industries

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Overview

Experience unparalleled power control and reliability with the IRG4PC40UDPBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are ideal for a wide range of applications. With a single configuration and built-in diode, this transistor offers seamless operation and maximum efficiency. Whether you're in need of high-power solutions or looking to optimize your electronic systems, the IRG4PC40UDPBF provides unmatched performance and durability. Elevate your projects with this innovative product and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics than P-channel transistors, making this a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with reverse polarity protection and allows for more efficient power control.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in this use case.

Maximum Power Dissipation (Abs): 160 W

With a high maximum power dissipation, this transistor can handle high power applications with ease.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating allows for use in a wide range of voltage applications.

Maximum Collector Current (IC): 40 A

With a high maximum collector current, this transistor can handle high current loads without issues.

Nominal Turn On Time (ton): 92 ns

Fast turn on time allows for quick switching and efficient power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC40UDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

120 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

330 ns

Nominal Turn On Time (ton):

92 ns

Trade Compliance

IRG4PC40UDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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