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IRG4PC50FPBF

Infineon Technologies

IRG4PC50FPBF by Infineon Technologies

IRG4PC50FPBF by Infineon Technologies is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 70A max collector current. It has a 190ns max fall time, making it suitable for high-power applications like motor drives and inverters. The package style is flange mount with through-hole terminals.

Median Price

$2.444

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

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$2.444

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$2.444

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Vyrian

USA . 7,292 parts In-Stock

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7,292

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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ComSIT Distribution GmbH

Germany . 1,611 parts In-Stock

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1,611

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ComSIT USA

USA . 1,611 parts In-Stock

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Digiode

USA . 251 parts In-Stock

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Lakeview Electronics

USA . 114 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,338 parts In-Stock

1+ parts

$1.650

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4,338

$1.650

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Modulus Dynamics

Lithuania . 1,950 parts In-Stock

1+ parts

$2.444

100+ parts

$2.346

1k+ parts

$2.248

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1,950

$2.444

$2.346

$2.248

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Corohmni

South Africa . 422 parts In-Stock

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$2.444

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422

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Continental Prestige Electronics

USA . 5,331 parts In-Stock

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$2.444

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$2.395

5,331

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$2.395

Argo Parts USA

USA . 2,109 parts In-Stock

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$2.444

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$2.517

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$2.391

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$2.391

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70

$2.517

$2.391

$2.391

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AZTECH Wire

Italy . 471 parts In-Stock

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$18.130

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471

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Semicontronic

India . 792 parts In-Stock

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$38.050

100+ parts

$37.099

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$36.908

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792

$38.050

$37.099

$36.908

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Ampacity Inc.

Singapore . 860 parts In-Stock

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$50.050

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Perfect Parts

USA . 16,940 parts In-Stock

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Microchip USA

USA . 3,815 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Kepictronics

USA . 1,300 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 657 parts In-Stock

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657

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Corphita

USA . 474 parts In-Stock

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474

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GreenTree Electronics

Israel . 175 parts In-Stock

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Assy Fe

Spain . 36 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the IRG4PC50FPBF by Infineon Technologies. As a leader in the industry, Infineon is known for producing high-quality Insulated Gate Bipolar Transistors that deliver exceptional performance and reliability. Ideal for a variety of applications, this N-CHANNEL transistor offers customers unparalleled value and benefits. Whether you're looking to enhance efficiency in power electronics or improve system performance, the IRG4PC50FPBF is the perfect solution. Trust Infineon to provide you with the innovative products you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, extending the lifespan of the IGBT.

Maximum Power Dissipation (Abs): 200 W

Allows for high power handling capability, making it suitable for demanding applications.

Maximum Collector-Emitter Voltage: 600 V

Can withstand high voltage levels, enhancing the versatility of the IGBT in various circuit designs.

Maximum Collector Current (IC): 70 A

Supports high current flow, enabling the IGBT to handle heavy loads without overheating.

Maximum Operating Temperature: 150 °C

Can operate efficiently at elevated temperatures, ensuring reliable performance in harsh environments.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC50FPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

190 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

620 ns

Nominal Turn On Time (ton):

52 ns

Trade Compliance

IRG4PC50FPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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