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SGP15N120XK

Infineon Technologies

SGP15N120XK by Infineon Technologies

Infineon's SGP15N120XK is an N-CHANNEL IGBT with 1200V VCE, 30A IC, and 68ns ton. Ideal for POWER CONTROL applications, it features a PLASTIC/EPOXY package, SINGLE configuration, and COLLECTOR case connection.

Median Price

$4.430

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$4.430

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10

$4.430

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Vyrian

USA . 1,094 parts In-Stock

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1,094

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Digiode

USA . 168 parts In-Stock

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168

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,650 parts In-Stock

1+ parts

$0.418

100+ parts

$0.401

1k+ parts

$0.385

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-

4,650

$0.418

$0.401

$0.385

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Corohmni

South Africa . 217 parts In-Stock

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$1.543

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217

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Aztec Data Supply Inc.

USA . 1,993 parts In-Stock

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$1.850

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$1.850

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Continental Prestige Electronics

USA . 4,226 parts In-Stock

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$4.430

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$4.341

4,226

$4.430

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$4.341

Argo Parts USA

USA . 4,067 parts In-Stock

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$4.430

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4,067

$4.430

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Netroflash

USA . 50 parts In-Stock

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$4.430

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$4.341

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50

$4.430

$4.341

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AZTECH Wire

Italy . 377 parts In-Stock

1+ parts

$7.981

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377

$7.981

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Ampacity Inc.

Singapore . 507 parts In-Stock

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$13.050

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507

$13.050

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Semicontronic

India . 1,072 parts In-Stock

1+ parts

$18.050

100+ parts

$17.599

1k+ parts

$17.508

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1,072

$18.050

$17.599

$17.508

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Corphita

USA . 864 parts In-Stock

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864

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Overview

Unlock the power of precise power control with the SGP15N120XK by Infineon Technologies. Crafted with top-quality materials and advanced technology, this Insulated Gate Bipolar Transistor (IGBT) offers unparalleled performance and reliability. Whether you're in the automotive, industrial, or renewable energy sector, this N-CHANNEL transistor is a game-changer. Say goodbye to downtime and hello to seamless operations with the SGP15N120XK. Elevate your projects with this single configuration transistor that provides maximum collector-emitter voltage and current, making it a must-have for any power control application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IGBT, making it reliable and durable.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state resistance and higher efficiency compared to P-CHANNEL IGBTs, making them a good choice for power control applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and allows for easier control and monitoring of the IGBT.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient and reliable performance in controlling high power levels.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum voltage rating, this IGBT can handle large voltage swings and is suitable for high-power applications.

Maximum Collector Current (IC): 30 A

Capable of handling up to 30 amps of current, this IGBT is suitable for medium to high power applications where current flow needs to be efficiently controlled.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SGP15N120XK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

683 ns

Nominal Turn On Time (ton):

68 ns

Trade Compliance

SGP15N120XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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