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SGP10N60RUFD

Onsemi

SGP10N60RUFD by Onsemi

SGP10N60RUFD by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.8V, IC of 16A, and Pmax of 75W. Ideal for POWER CONTROL applications due to its fast tf of 350ns and toff of 284ns, operating at temperatures from -55 °C to 150°C.

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Lifecycle Status

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Vyrian

USA . 1,885 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,573 parts In-Stock

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TANS Electronics

Latvia . 5,887 parts In-Stock

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SupplyDigital Components

Austria . 4,215 parts In-Stock

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Problanco Electronics

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Corphita

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UHIMA Technologies

Türkiye . 940 parts In-Stock

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Kulean Microsystems

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Corohmni

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Overview

Experience the superior performance and reliability of the Onsemi SGP10N60RUFD Insulated Gate Bipolar Transistor. Crafted by a renowned manufacturer, this N-CHANNEL transistor offers seamless power control in a variety of applications. With a maximum collector-emitter voltage of 600V and a package style designed for easy mounting, this transistor provides unparalleled value and efficiency. Trust in Onsemi to deliver quality products that meet your power control needs with precision and ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent insulation and protection for the components inside, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-state voltage drop and higher efficiency compared to P-channel types.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for bidirectional current flow and simplifies circuit design in power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in controlling high power loads.

Maximum VCEsat: 2.8 V

Low saturation voltage helps reduce power losses and improves efficiency during operation.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient PCB layout and space-saving design.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, especially in high-power applications.

Maximum Fall Time (tf): 350 ns

Fast fall time ensures quick switching speed, reducing switching losses and improving overall efficiency.

Nominal Turn Off Time (toff): 284 ns

Low turn-off time helps in controlling the switching frequency and ensuring minimal power dissipation.

No. of Terminals: 3

Simple 3-terminal setup for easy integration into circuits and systems.

Maximum Power Dissipation (Abs): 75 W

High power dissipation capability allows for handling high power loads without overheating or damage.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides mechanical support and easy mounting in various applications.

Maximum Operating Temperature: 150 °C

Wide operating temperature range ensures consistent performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating enables handling of high voltage levels in power control applications.

Transistor Element Material: SILICON

Silicon-based element material offers high reliability, temperature stability, and performance in IGBTs.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures reliable and safe operation during switching events.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in extreme cold environments.

Maximum Collector Current (IC): 16 A

High collector current rating enables handling of large current loads in power control applications.

Maximum Gate-Emitter Threshold Voltage: 8.5 V

Optimal gate-emitter threshold voltage for efficient switching and control of the IGBT.

Maximum Turn Off Time (toff): 410 ns

Improved turn-off time for controlling the switching speed and minimizing power losses during operation.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection in circuits and systems.

Nominal Turn On Time (ton): 49 ns

Fast turn-on time for quick response and efficient switching in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SGP10N60RUFD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

350 ns

Maximum Gate-Emitter Threshold Voltage:

8.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

410 ns

Nominal Turn Off Time (toff):

284 ns

Nominal Turn On Time (ton):

49 ns

Maximum VCEsat:

2.8 V

Trade Compliance

SGP10N60RUFD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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