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SGP13N60UFD

Onsemi

SGP13N60UFD by Onsemi

SGP13N60UFD by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.6V, IC of 13A, and Pmax of 60W. Ideal for MOTOR CONTROL applications due to its fast tf of 250ns and toff of 253ns at a max VCE of 600V.

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Vyrian

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Digiode

USA . 1,796 parts In-Stock

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LWI Electronics Inc

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

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TANS Electronics

Latvia . 6,166 parts In-Stock

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Problanco Electronics

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Corphita

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Corohmni

South Africa . 253 parts In-Stock

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UHIMA Technologies

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Overview

Elevate your motor control systems with the SGP13N60UFD by Onsemi. Crafted with precision and backed by the reputable manufacturer, this insulated gate bipolar transistor promises reliability and efficiency. Ideal for various applications in the industrial sector, this N-channel transistor with a built-in diode offers seamless operation and optimal performance. Upgrade your projects with the cutting-edge technology of the SGP13N60UFD and experience the unparalleled value it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IGBT, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower conduction losses and higher efficiency compared to P-channel types, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse voltage spikes, enhancing the overall performance and reliability of the IGBT.

Transistor Application: MOTOR CONTROL

Designed specifically for motor control applications, this IGBT is optimized for high-power output, precise control, and efficient operation.

Maximum VCEsat: 2.6 V

Low VCEsat reduces power losses and improves efficiency during operation, making this IGBT ideal for energy-efficient systems.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and easy soldering, ensuring a stable electrical connection for the IGBT.

Maximum Fall Time (tf): 250 ns

Fast fall time allows for quick switching and response times, improving the performance and efficiency of the IGBT in high-frequency applications.

Nominal Turn Off Time (toff): 253 ns

The fast turn-off time reduces switching losses and increases efficiency, making this IGBT suitable for high-speed switching applications.

No. of Terminals: 3

Having three terminals allows for easy connections and control of the IGBT in various circuit configurations.

Maximum Power Dissipation (Abs): 60 W

With a high power dissipation capability, this IGBT can handle substantial power levels without overheating, ensuring reliable operation under heavy loads.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and thermal dissipation, ensuring stable operation in high-temperature environments.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating allows the IGBT to handle high voltage applications, making it suitable for power electronics and motor drives.

Transistor Element Material: SILICON

Silicon offers high reliability, efficiency, and switching speed, making it a preferred material for power semiconductor devices like IGBTs.

Maximum Gate-Emitter Voltage: 20 V

The high gate-emitter voltage rating ensures safe and reliable operation of the IGBT, preventing damage from overvoltage conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the IGBT to function in extreme cold conditions, making it suitable for a wide range of environments.

Maximum Collector Current (IC): 13 A

With a high collector current rating, this IGBT can handle large current loads, making it suitable for high-power applications like motor control and inverters.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage ensures precise and stable control of the IGBT, allowing for efficient switching and performance.

Maximum Turn Off Time (toff): 450 ns

The fast turn-off time allows for quick response and switching, reducing power losses and improving efficiency in high-speed applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and connection of the IGBT in electronic circuits, reducing complexity and potential errors.

Nominal Turn On Time (ton): 62 ns

Fast turn-on time enables rapid switching and response, improving the performance and efficiency of the IGBT in dynamic applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SGP13N60UFD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

250 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

450 ns

Nominal Turn Off Time (toff):

253 ns

Nominal Turn On Time (ton):

62 ns

Maximum VCEsat:

2.6 V

Trade Compliance

SGP13N60UFD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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