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IRGP4063DPBF

Infineon Technologies

IRGP4063DPBF by Infineon Technologies

IRGP4063DPBF by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 600V and Max Collector Current of 96A. It is designed for POWER CONTROL applications, featuring a Max Power Dissipation of 330W and a Nominal Turn Off Time of 210ns. Ideal for high-power switching in various electronic systems.

Median Price

$5.513

Lifecycle Status

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Chip1Stop

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$6.800

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Verical

USA . 1,359 parts In-Stock

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$5.513

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$4.925

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Rochester

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$4.420

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$3.950

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$3.720

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$3.720

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Digiode

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$4.674

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Nova Conductors

Japan . 500 parts In-Stock

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$6.750

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Maritex

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Chip Stock

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Cyclops Electronics Ltd

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Bristol Electronics

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ComSIT Distribution GmbH

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GLYN GmbH & Co. KG

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Micros

Poland . 25 parts In-Stock

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Partservice

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$3.840

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$3.840

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$3.840

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$3.840

$3.840

Martec Srl

Italy . 13 parts In-Stock

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Prism Electronics

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Aztec Data Supply Inc.

USA . 2,793 parts In-Stock

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$0.677

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$0.677

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Semicontronic

India . 780 parts In-Stock

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$4.180

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$4.076

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$4.055

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780

$4.180

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$4.055

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Ampacity Inc.

Singapore . 486 parts In-Stock

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$4.180

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Corphita

USA . 31 parts In-Stock

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$4.428

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Modulus Dynamics

Lithuania . 19,325 parts In-Stock

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$6.113

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$5.868

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$5.624

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Corohmni

South Africa . 31 parts In-Stock

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Continental Prestige Electronics

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$6.690

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$6.556

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Netroflash

USA . 500 parts In-Stock

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$6.750

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$6.750

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RC Electronics

USA . 45,000 parts In-Stock

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$6.400

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$6.030

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$5.910

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Perfect Parts

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Glotronic Ltd.

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Infinite Electronics LLP (Excess)

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iodParts Technologies Inc.

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GreenTree Electronics

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Microchip USA

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Overview

Experience superior power control with the IRGP4063DPBF Insulated Gate Bipolar Transistor (IGBT) by Infineon Technologies. This N-CHANNEL transistor offers reliable performance and efficiency in a variety of applications. With a maximum collector-emitter voltage of 600V and a maximum power dissipation of 330W, this transistor is designed to meet your power control needs. Trust Infineon Technologies for quality products that deliver exceptional value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this IGBT lightweight and durable, ideal for applications where weight and longevity are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drops and faster switching speeds, making them suitable for high-performance power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this IGBT simplifies circuit design and allows for more efficient power control, making it a convenient choice for various power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT offers reliable and precise control over power, making it a versatile choice for a wide range of applications.

Maximum Rise Time (tr): 56 ns

With a fast rise time of 56 ns, this IGBT can quickly switch on and off, making it suitable for high-frequency switching applications where speed is crucial.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and efficient use of PCB space, making this IGBT a convenient choice for densely populated circuit boards.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and reliable connection, ensuring stable performance in demanding operating conditions.

Maximum Fall Time (tf): 46 ns

The fast fall time of 46 ns ensures quick turn-off of the IGBT, reducing power dissipation and enhancing overall efficiency in power control applications.

Nominal Turn Off Time (toff): 210 ns

The nominal turn-off time of 210 ns indicates the time it takes for the IGBT to turn off, allowing for precise control over power flow and improving overall system performance.

No. of Terminals: 3

With three terminals, this IGBT offers a simple and straightforward connection setup, making it easy to integrate into a variety of circuit designs.

Maximum Power Dissipation (Abs): 330 W

This IGBT can handle a maximum power dissipation of 330 W, making it suitable for applications where high power handling capability is required.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting, making this IGBT ideal for applications where vibration and mechanical stress are concerns.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this IGBT can withstand high temperatures, ensuring reliable performance in challenging environments.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating of 600 V makes this IGBT suitable for applications requiring high voltage handling capability.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high performance and reliability, making this IGBT a durable and long-lasting choice for various applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20 V provides ample headroom for voltage spikes and ensures stable performance in power control applications.

Maximum Collector Current (IC): 96 A

This IGBT can handle a maximum collector current of 96 A, making it suitable for applications requiring high current handling capability.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage of 6.5 V ensures precise control over the IGBT, allowing for accurate power regulation in various applications.

Terminal Finish: MATTE TIN OVER NICKEL

The matte tin over nickel terminal finish provides excellent corrosion resistance and ensures a reliable connection, extending the lifespan of this IGBT.

Terminal Position: SINGLE

With a single terminal position, this IGBT offers straightforward installation and connection, simplifying the integration into circuit designs.

Case Connection: COLLECTOR

The case connection is at the collector, allowing for efficient heat dissipation and enhancing the overall thermal performance of this IGBT.

Nominal Turn On Time (ton): 100 ns

With a nominal turn-on time of 100 ns, this IGBT can quickly switch on, ensuring precise power control and improving system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGP4063DPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

46 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

56 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

210 ns

Nominal Turn On Time (ton):

100 ns

Trade Compliance

IRGP4063DPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-633-0083, 5961016330083

NIIN

016330083

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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