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FF900R12IE4VBOSA1

Infineon Technologies

FF900R12IE4VBOSA1 by Infineon Technologies

FF900R12IE4VBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V. It has a nominal turn-off time of 940ns and a nominal turn-on time of 350ns. This IGBT is commonly used in applications that require high power switching, such as motor drives and power supplies.

Median Price

$583.960

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 448 parts In-Stock

1+ parts

$482.380

100+ parts

$453.440

1k+ parts

$424.490

10k+ parts

-

448

$482.380

$453.440

$424.490

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DigiKey

USA . 372 parts In-Stock

1+ parts

$583.960

100+ parts

-

1k+ parts

-

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372

$583.960

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-

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Verical

USA . 379 parts In-Stock

1+ parts

$701.875

100+ parts

$659.763

1k+ parts

$596.600

10k+ parts

-

379

$701.875

$659.763

$596.600

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 3 parts In-Stock

1+ parts

$121.280

100+ parts

-

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-

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3

$121.280

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-

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Digiode

USA . 438 parts In-Stock

1+ parts

$533.425

100+ parts

-

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-

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438

$533.425

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-

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Nova Conductors

Japan . 58 parts In-Stock

1+ parts

$592.214

100+ parts

-

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58

$592.214

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Vyrian

USA . 2,205 parts In-Stock

1+ parts

-

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2,205

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 23,423 parts In-Stock

1+ parts

$0.775

100+ parts

$0.744

1k+ parts

$0.713

10k+ parts

-

23,423

$0.775

$0.744

$0.713

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Ampacity Inc.

Singapore . 225 parts In-Stock

1+ parts

$477.270

100+ parts

-

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225

$477.270

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Corphita

USA . 219 parts In-Stock

1+ parts

$505.350

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-

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219

$505.350

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Continental Prestige Electronics

USA . 6,681 parts In-Stock

1+ parts

$592.214

100+ parts

-

1k+ parts

-

10k+ parts

$580.370

6,681

$592.214

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-

$580.370

Argo Parts USA

USA . 504 parts In-Stock

1+ parts

$592.214

100+ parts

$586.292

1k+ parts

$580.370

10k+ parts

$574.447

504

$592.214

$586.292

$580.370

$574.447

Netroflash

USA . 100 parts In-Stock

1+ parts

$592.214

100+ parts

$580.370

1k+ parts

-

10k+ parts

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100

$592.214

$580.370

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Semicontronic

India . 337 parts In-Stock

1+ parts

$1,038.780

100+ parts

$1,012.810

1k+ parts

$1,007.617

10k+ parts

-

337

$1,038.780

$1,012.810

$1,007.617

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Perfect Parts

USA . 7 parts In-Stock

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7

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Overview

Discover the FF900R12IE4VBOSA1 by Infineon Technologies, a game-changer in the world of Insulated Gate Bipolar Transistors (IGBT). With its high-quality manufacturing and superior design, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, this N-CHANNEL transistor boasts a series-connected configuration with built-in diode and thermistor. Its rectangular shape and flange mount package style make it easy to install and integrate into various systems. Experience the benefits of this advanced technology, including fast turn-off and turn-on times, maximum collector-emitter voltage of 1200V, and exceptional temperature resistance from -40°C. The FF900R12IE4VBOSA1 is the ultimate choice for professionals seeking unmatched value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material provides excellent insulation and protection, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

With its N-channel design, this product offers superior performance in terms of high voltage capabilities, making it suitable for power applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The series connected configuration with a center tap, along with the built-in diode and thermistor, ensures efficient and reliable operation, making this product an ideal choice for applications requiring precision and protection.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for easy and convenient installation, maximizing efficiency and saving space in various electronic designs.

No. of Elements: 2

With two elements, this IGBT product provides increased power handling capabilities and improved efficiency, making it a reliable choice for demanding applications that require high performance.

Nominal Turn Off Time (toff): 940 ns

Boasting a fast nominal turn-off time of 940 ns, this IGBT ensures quick switching characteristics, minimizing power loss and enhancing overall efficiency in various applications.

No. of Terminals: 10

With ten terminals, this IGBT provides versatile connectivity options and facilitates easy integration into complex electronic systems, making it a flexible choice for diverse applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style of this IGBT ensures secure and stable mounting, enabling efficient heat dissipation and enhancing overall reliability in demanding environments.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage of 1200 V, this IGBT offers excellent voltage handling capabilities, making it suitable for applications that require high power requirements.

Transistor Element Material: SILICON

The silicon transistor element material used in this product ensures superior performance and reliability, making it a trusted choice for applications that demand high temperature and voltage operation.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this IGBT can withstand extreme temperature conditions, making it suitable for use in harsh environments.

Terminal Position: UPPER

The upper terminal position of this IGBT enhances accessibility and ease of use during installation and connection, ensuring convenient integration into various electronic systems.

Case Connection: ISOLATED

The isolated case connection of this IGBT ensures enhanced safety and protection against electrical interference, making it a reliable choice for applications that require isolation and insulation.

Nominal Turn On Time (ton): 350 ns

Featuring a nominal turn-on time of 350 ns, this IGBT offers fast switching characteristics, enabling rapid power transistor operation and enhancing overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF900R12IE4VBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-PUFM-X10

No. of Elements:

2

No. of Terminals:

10

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

GENERAL PURPOSE

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

940 ns

Nominal Turn On Time (ton):

350 ns

Trade Compliance

FF900R12IE4VBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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