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AUIRGP4066D1-E

Infineon Technologies

AUIRGP4066D1-E by Infineon Technologies

AUIRGP4066D1-E by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 140A max collector current, and 454W max power dissipation. Ideal for power control applications, it features a single configuration with built-in diode and fast switching times of 100ns rise and 80ns fall.

Median Price

$9.142

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3,484 parts In-Stock

1+ parts

-

100+ parts

$9.142

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3,484

-

$9.142

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Distributors (In-Stock)

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DF Sales Co.

USA . 100 parts In-Stock

1+ parts

$5.950

100+ parts

-

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100

$5.950

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DF Sales Co.

USA . 100 parts In-Stock

1+ parts

$5.950

100+ parts

-

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100

$5.950

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-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$7.541

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500

$7.541

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VNN

France . 22,839 parts In-Stock

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22,839

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Vyrian

USA . 3,281 parts In-Stock

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3,281

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Digiode

USA . 314 parts In-Stock

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314

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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50

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ComSIT USA

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 188 parts In-Stock

1+ parts

$0.946

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-

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188

$0.946

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Modulus Dynamics

Lithuania . 20,426 parts In-Stock

1+ parts

$1.548

100+ parts

$1.486

1k+ parts

$1.424

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-

20,426

$1.548

$1.486

$1.424

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Corohmni

South Africa . 238 parts In-Stock

1+ parts

$1.564

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238

$1.564

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Advanced Electronics

New Zealand . 82 parts In-Stock

1+ parts

$1.862

100+ parts

$1.694

1k+ parts

$1.527

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82

$1.862

$1.694

$1.527

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Continental Prestige Electronics

USA . 3,637 parts In-Stock

1+ parts

$7.541

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$7.390

3,637

$7.541

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$7.390

Netroflash

USA . 50 parts In-Stock

1+ parts

$7.541

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50

$7.541

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Semicontronic

India . 3,330 parts In-Stock

1+ parts

$7.770

100+ parts

$7.576

1k+ parts

$7.537

10k+ parts

-

3,330

$7.770

$7.576

$7.537

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Ampacity Inc.

Singapore . 3,291 parts In-Stock

1+ parts

$7.770

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3,291

$7.770

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Microchip USA

USA . 173 parts In-Stock

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$21.168

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173

$21.168

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QUARKTWIN TECHNOLOGY LTD

USA . 24,872 parts In-Stock

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Argo Parts USA

USA . 1,509 parts In-Stock

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1,509

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Perfect Parts

USA . 588 parts In-Stock

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588

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Corphita

USA . 7 parts In-Stock

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7

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Overview

Unleash the power of efficient power control with the AUIRGP4066D1-E by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor with a built-in diode is perfect for various applications where power control is essential. With a maximum collector-emitter voltage of 600V and a maximum collector current of 140A, this transistor offers unparalleled performance and efficiency. Upgrade your power control systems today with the AUIRGP4066D1-E and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IGBT, ensuring reliable performance in various conditions.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and switching capabilities, making it suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and offers added functionality with the built-in diode, saving space and cost.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, providing high performance and efficiency in controlling electrical power.

Maximum Power Dissipation (Abs): 454 W

Capable of handling high power levels, making it suitable for demanding applications where power dissipation is a key factor.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without compromising performance, ensuring reliability in various operating conditions.

Maximum Collector-Emitter Voltage: 600 V

Handles high voltage levels with ease, making it suitable for high-power applications where voltage regulation is crucial.

Maximum Collector Current (IC): 140 A

Capable of handling high current levels, making it suitable for applications that require high current switching capabilities.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Allows for precise control over the switching of the transistor, ensuring reliable performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AUIRGP4066D1-E attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

80 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

250

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

100 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

320 ns

Nominal Turn On Time (ton):

115 ns

Trade Compliance

AUIRGP4066D1-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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