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AUIRGP4062D

Infineon Technologies

AUIRGP4062D by Infineon Technologies

AUIRGP4062D by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 600V and Max Power Dissipation of 250W. It has a Nominal Turn Off Time of 164ns, making it ideal for POWER CONTROL applications requiring fast switching speeds in high-power environments. The package style is FLANGE MOUNT with a RECTANGULAR shape and THROUGH-HOLE terminals.

Median Price

$5.982

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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RS (Exports)

UK . 83 parts In-Stock

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$2.980

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$2.980

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Mouser Electronics

USA . 40 parts In-Stock

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$7.940

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$6.330

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40

$7.940

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$6.330

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RS Americas

USA . 83 parts In-Stock

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$8.100

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$6.880

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83

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DigiKey

USA . 1,587 parts In-Stock

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$6.140

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Verical

USA . 1,125 parts In-Stock

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$5.825

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$5.213

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$4.912

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$5.213

$4.912

Rochester

USA . 872 parts In-Stock

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$4.660

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$4.170

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$3.930

872

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$3.930

Distributors (In-Stock)

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Digiode

USA . 586 parts In-Stock

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$2.831

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VNN

France . 3,073 parts In-Stock

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DigiKey Marketplace

USA . 1,587 parts In-Stock

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Vyrian

USA . 924 parts In-Stock

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Ashlea Components Ltd

UK . 30 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Aztec Data Supply Inc.

USA . 186 parts In-Stock

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$0.461

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Corohmni

South Africa . 388 parts In-Stock

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$0.939

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$0.939

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Modulus Dynamics

Lithuania . 24,449 parts In-Stock

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$1.093

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$1.049

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$1.006

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Ampacity Inc.

Singapore . 1,026 parts In-Stock

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$2.530

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Corphita

USA . 152 parts In-Stock

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$2.682

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Microchip USA

USA . 144 parts In-Stock

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$24.920

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,009 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,084 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Argo Parts USA

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Perfect Parts

USA . 364 parts In-Stock

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Overview

Unleash the power of Infineon Technologies with the AUIRGP4062D Insulated Gate Bipolar Transistor (IGBT). This N-channel transistor, with a single configuration and built-in diode, is designed for power control applications. With a maximum collector-emitter voltage of 600V and a maximum operating temperature of 175°C, this IGBT offers unmatched performance and reliability. Whether you're in the automotive, industrial, or renewable energy sector, this product provides the efficiency and durability you need to take your projects to the next level. Upgrade to the AUIRGP4062D and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for efficient power control and high-speed switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and enhances overall efficiency in power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, making it well-suited for a wide range of industrial and electronic systems.

Maximum Rise Time (tr): 31 ns

Fast rise time enables quick response and precise power management, ideal for high-performance applications.

Package Shape: RECTANGULAR

Rectangular shape provides ease of mounting and space-saving design for efficient PCB layout.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure connections and easy integration into electronic systems.

Maximum Fall Time (tf): 41 ns

Fast fall time contributes to efficient switching and overall performance of the IGBT.

Nominal Turn Off Time (toff): 164 ns

Relatively short turn off time enhances operational efficiency and power management capabilities.

No. of Terminals: 3

Three terminals provide necessary connections for power control and circuit integration.

Maximum Power Dissipation (Abs): 250 W

High power dissipation rating allows for handling of significant power loads with efficiency.

Package Style (Meter): FLANGE MOUNT

Flange mount design offers secure attachment and efficient heat dissipation for optimal performance.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating enables the IGBT to handle substantial voltage levels in power control applications.

Transistor Element Material: SILICON

Silicon material ensures stability and reliability in operation, making it a suitable choice for power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating allows for precise control and efficient operation of the IGBT.

Maximum Collector Current (IC): 48 A

High collector current rating enables the IGBT to handle significant current loads with efficiency.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Gate-emitter threshold voltage helps in controlling the conduction of the IGBT, ensuring accuracy in power management.

Terminal Position: SINGLE

Single terminal position simplifies connections and enhances ease of integration into electronic systems.

Case Connection: COLLECTOR

Collector case connection ensures efficient heat dissipation and reliable operation of the IGBT.

Nominal Turn On Time (ton): 64 ns

Fast turn on time allows for quick activation and precise power control, enhancing overall performance of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AUIRGP4062D attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

41 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

31 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

164 ns

Nominal Turn On Time (ton):

64 ns

Trade Compliance

AUIRGP4062D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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