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IRG4BC30W-SPBF

Infineon Technologies

IRG4BC30W-SPBF by Infineon Technologies

IRG4BC30W-SPBF by Infineon Technologies is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max collector current of 23A. It has a nominal turn-off time of 300ns, making it suitable for power control applications requiring fast switching speeds. With a package style of SMALL OUTLINE and surface mount capability, it offers efficient power dissipation up to 100W in various electronic devices.

Median Price

$1.343

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

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Nova Conductors

Japan . 18 parts In-Stock

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Vyrian

USA . 824 parts In-Stock

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Sunrise Surplus Inc.

USA . 49 parts In-Stock

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Euro-Tech

UK . 20 parts In-Stock

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Digiode

USA . 1 parts In-Stock

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Distributors (Availability)

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Argo Parts USA

USA . 1,258 parts In-Stock

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Continental Prestige Electronics

USA . 1,031 parts In-Stock

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$1.316

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Netroflash

USA . 500 parts In-Stock

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$1.316

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Modulus Dynamics

Lithuania . 14,586 parts In-Stock

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$1.899

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$1.823

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$1.747

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Ampacity Inc.

Singapore . 977 parts In-Stock

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$15.050

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AZTECH Wire

Italy . 467 parts In-Stock

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Component Stockers USA

USA . 631 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Corphita

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Perfect Parts

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Overview

Unlock the power of efficient and reliable performance with the IRG4BC30W-SPBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies brings you top-quality Insulated Gate Bipolar Transistors designed for power control applications. With a maximum operating temperature of 150°C and a collector-emitter voltage of 600V, this N-channel transistor offers exceptional durability and performance. Experience the benefits of faster fall times and nominal turn-off times, ensuring seamless power management in your projects. Trust in the value and advantages that Infineon Technologies delivers with the IRG4BC30W-SPBF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring reliable performance in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-state resistance and higher switching speeds compared to P-channel, making them more efficient for power control applications.

Maximum Power Dissipation (Abs): 100 W

With a maximum power dissipation of 100W, this IGBT can handle high power levels efficiently, making it suitable for demanding power control tasks.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating of 600V allows this IGBT to be used in applications requiring high voltage switching capabilities.

Maximum Collector Current (IC): 23 A

The high collector current rating of 23A enables this IGBT to handle large currents, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures that this IGBT can operate reliably in demanding environmental conditions without overheating.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC30W-SPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

100 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

300 ns

Nominal Turn On Time (ton):

41 ns

Trade Compliance

IRG4BC30W-SPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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