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F4150R12KS4BOSA1

Infineon Technologies

F4150R12KS4BOSA1 by Infineon Technologies

F4150R12KS4BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 4 elements in a bridge configuration. It has a max collector-emitter voltage of 1200V and can handle a collector current of 180A, making it ideal for power control applications. With a turn-off time of 390ns and turn-on time of 190ns, this UL RECOGNIZED transistor is designed for high-power operations.

Median Price

$246.480

Lifecycle Status

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10

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1k+

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Arrow

USA . 8 parts In-Stock

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$246.480

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8

$246.480

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Verical

USA . 8 parts In-Stock

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$246.480

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$246.480

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Chip1Stop

Japan . 8 parts In-Stock

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$260.000

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$260.000

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Rochester

USA . 29 parts In-Stock

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$109.750

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$98.200

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$92.420

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$92.420

DigiKey

USA . 29 parts In-Stock

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Digiode

USA . 262 parts In-Stock

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$131.566

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TME

Poland . 9 parts In-Stock

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$191.320

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$191.320

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Nova Conductors

Japan . 54 parts In-Stock

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$282.750

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Vyrian

USA . 2,013 parts In-Stock

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IBS Electronics

USA . 60 parts In-Stock

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$165.593

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Corohmni

South Africa . 398 parts In-Stock

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$0.757

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$0.757

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Modulus Dynamics

Lithuania . 4,937 parts In-Stock

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$1.121

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$1.076

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$1.031

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Aztec Data Supply Inc.

USA . 2,412 parts In-Stock

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$1.151

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AZTECH Wire

Italy . 711 parts In-Stock

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$6.043

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Corphita

USA . 255 parts In-Stock

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$124.641

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Ampacity Inc.

Singapore . 14 parts In-Stock

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$256.210

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Aranea Global

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$277.095

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$266.011

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$277.095

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Continental Prestige Electronics

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$306.670

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Microchip USA

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$552.960

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Authorized Procurement Solutions

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Argo Parts USA

USA . 882 parts In-Stock

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Overview

Unlock the power of next-generation technology with the F4150R12KS4BOSA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. Ideal for power control applications, this transistor offers unparalleled performance and reliability. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 180A, the F4150R12KS4BOSA1 is designed to meet all your power needs. Trust Infineon Technologies to provide you with the cutting-edge technology you need to stay ahead of the curve.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their superior performance and efficiency, making them a popular choice for power control applications.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor help in improving the overall reliability and efficiency of the bridge configuration, adding value to the product.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is capable of handling high currents and voltages efficiently.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into electronic systems.

No. of Elements: 4

Having 4 elements provides redundancy and helps in distributing the workload, enhancing the system's overall performance and reliability.

Nominal Turn Off Time (toff): 390 ns

The quick turn-off time ensures minimal power losses and efficient switching, making it ideal for high-speed power control applications.

No. of Terminals: 26

With 26 terminals, this IGBT offers versatility in connectivity options, allowing for a wide range of application possibilities.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides a secure and stable mounting solution, ideal for applications where mechanical stability is crucial.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating ensures that the IGBT can handle high voltage operations without breakdown, making it suitable for demanding applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, known for its high conductivity and stability, ensuring long-term performance.

Maximum Collector Current (IC): 180 A

Capable of handling high currents of up to 180A, this IGBT is suitable for power control applications that require high power handling capabilities.

Terminal Position: UPPER

The upper terminal position makes it easy to access and connect, simplifying the installation process and ensuring efficient operation.

Case Connection: ISOLATED

The isolated case connection helps in preventing electrical interference and enhances the safety of the system, making it a reliable choice for various applications.

Nominal Turn On Time (ton): 190 ns

The fast turn-on time of 190 ns ensures quick response and efficient power control, making it suitable for applications that require rapid switching.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that the product meets high safety and quality standards, providing peace of mind to users and ensuring compliance with regulations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) F4150R12KS4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X26

No. of Elements:

4

No. of Terminals:

26

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

390 ns

Nominal Turn On Time (ton):

190 ns

Trade Compliance

F4150R12KS4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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