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FF225R12MS4BOSA1

Infineon Technologies

FF225R12MS4BOSA1 by Infineon Technologies

Infineon's FF225R12MS4BOSA1 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and thermistor. Featuring 1200V max collector-emitter voltage, it has a 590ns turn off time and 275A max collector current. Ideal for applications requiring high power switching in industrial settings.

Median Price

$151.072

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 931 parts In-Stock

1+ parts

$138.920

100+ parts

$130.580

1k+ parts

$122.250

10k+ parts

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931

$138.920

$130.580

$122.250

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DigiKey

USA . 931 parts In-Stock

1+ parts

-

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931

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Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$163.225

1k+ parts

$152.813

10k+ parts

-

800

-

$163.225

$152.813

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Distributors (In-Stock)

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Digiode

USA . 325 parts In-Stock

1+ parts

$170.934

100+ parts

-

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325

$170.934

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Nova Conductors

Japan . 92 parts In-Stock

1+ parts

$207.626

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92

$207.626

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Vyrian

USA . 7,754 parts In-Stock

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7,754

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 110 parts In-Stock

1+ parts

$0.380

100+ parts

-

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110

$0.380

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Corohmni

South Africa . 384 parts In-Stock

1+ parts

$1.576

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-

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384

$1.576

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Modulus Dynamics

Lithuania . 25,407 parts In-Stock

1+ parts

$1.845

100+ parts

$1.771

1k+ parts

$1.697

10k+ parts

-

25,407

$1.845

$1.771

$1.697

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AZTECH Wire

Italy . 369 parts In-Stock

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$16.400

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369

$16.400

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Semicontronic

India . 171 parts In-Stock

1+ parts

$152.940

100+ parts

$149.116

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$148.352

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171

$152.940

$149.116

$148.352

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Corphita

USA . 801 parts In-Stock

1+ parts

$161.937

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801

$161.937

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Component Stockers USA

USA . 605 parts In-Stock

1+ parts

$187.630

100+ parts

$179.340

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605

$187.630

$179.340

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Continental Prestige Electronics

USA . 2,722 parts In-Stock

1+ parts

$207.626

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$203.474

2,722

$207.626

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$203.474

Microchip USA

USA . 5,846 parts In-Stock

1+ parts

$268.785

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5,846

$268.785

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Ampacity Inc.

Singapore . 171 parts In-Stock

1+ parts

$332.870

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171

$332.870

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QUARKTWIN TECHNOLOGY LTD

USA . 8,556 parts In-Stock

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8,556

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Argo Parts USA

USA . 1,850 parts In-Stock

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1,850

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Overview

Discover the Infineon Technologies FF225R12MS4BOSA1, a top-of-the-line Insulated Gate Bipolar Transistor that offers unparalleled quality and reliability. With a manufacturer like Infineon Technologies behind it, you can trust in the exceptional performance and durability of this N-CHANNEL transistor. Ideal for a wide range of applications, this series connected, center tap device with built-in diode and thermistor provides customers with superior value and benefits. Whether you're looking for efficiency, power, or reliability, the FF225R12MS4BOSA1 has you covered.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have lower on-state voltage drop and higher current-carrying capability compared to P-CHANNEL ones, making them more efficient for many applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for better control and protection of the IGBT, ensuring stability and reliability in operation.

Package Shape: RECTANGULAR

Rectangular packages are typically easier to mount and handle, making the IGBT more user-friendly for installation and maintenance purposes.

Nominal Turn Off Time (toff): 590 ns

The fast turn-off time of 590 ns helps in reducing switching losses and improving overall efficiency of the IGBT.

No. of Terminals: 11

Having more terminals allows for more connections and control options, increasing the versatility and customization potential of the IGBT.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this IGBT can withstand a wide range of environmental conditions and high power levels.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage of 1200V makes this IGBT suitable for high-power applications requiring high voltage handling capabilities.

Transistor Element Material: SILICON

Silicon is known for its reliability and efficiency in power electronics, making IGBTs with this material a popular choice in the industry.

Maximum Collector Current (IC): 275 A

With a maximum collector current of 275A, this IGBT can handle high current loads, making it suitable for power systems and industrial applications.

Terminal Position: UPPER

The upper terminal position may provide better accessibility and ease of connection in certain circuit layouts or mounting configurations.

Case Connection: ISOLATED

An isolated case connection helps in reducing the risk of electrical interference or short circuits, ensuring safety and reliability in operation.

Nominal Turn On Time (ton): 180 ns

The fast turn-on time of 180 ns allows for quick switching and high-frequency operation, contributing to the efficiency and performance of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF225R12MS4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

590 ns

Nominal Turn On Time (ton):

180 ns

Trade Compliance

FF225R12MS4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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