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IRG4PC30FPBF

Infineon Technologies

IRG4PC30FPBF by Infineon Technologies

IRG4PC30FPBF by Infineon Technologies is an N-CHANNEL IGBT transistor with 600V max collector-emitter voltage and 31A max collector current. It has a turn-off time of 640ns, turn-on time of 36ns, and can dissipate up to 100W power. Ideal for power control applications due to its single configuration and flange mount package style.

Median Price

$1.976

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,002 parts In-Stock

1+ parts

-

100+ parts

$1.620

1k+ parts

$1.450

10k+ parts

$1.370

1,002

-

$1.620

$1.450

$1.370

DigiKey

USA . 1,002 parts In-Stock

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$2.140

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1,002

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$2.140

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Verical

USA . 1,002 parts In-Stock

1+ parts

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$1.813

10k+ parts

$1.712

1,002

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$1.813

$1.712

Farnell

UK . 451 parts In-Stock

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$2.191

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451

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$2.191

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Distributors (In-Stock)

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Digiode

USA . 83 parts In-Stock

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$1.720

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83

$1.720

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Nova Conductors

Japan . 50 parts In-Stock

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$1.768

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50

$1.768

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Chip Stock

USA . 9,700 parts In-Stock

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9,700

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DigiKey Marketplace

USA . 1,666 parts In-Stock

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1,666

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Vyrian

USA . 826 parts In-Stock

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826

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ComSIT Distribution GmbH

Germany . 175 parts In-Stock

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175

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 6,961 parts In-Stock

1+ parts

$0.830

100+ parts

$0.797

1k+ parts

$0.764

10k+ parts

-

6,961

$0.830

$0.797

$0.764

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Corohmni

South Africa . 977 parts In-Stock

1+ parts

$1.349

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977

$1.349

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Aztec Data Supply Inc.

USA . 3,347 parts In-Stock

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$1.409

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$1.409

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Ampacity Inc.

Singapore . 1,014 parts In-Stock

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$1.540

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1,014

$1.540

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Semicontronic

India . 806 parts In-Stock

1+ parts

$1.540

100+ parts

$1.502

1k+ parts

$1.494

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806

$1.540

$1.502

$1.494

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Corphita

USA . 801 parts In-Stock

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$1.629

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801

$1.629

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Aranea Global

USA . 100 parts In-Stock

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$1.733

100+ parts

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$1.663

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100

$1.733

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$1.663

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Continental Prestige Electronics

USA . 5,134 parts In-Stock

1+ parts

$1.768

100+ parts

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$1.733

5,134

$1.768

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$1.733

Argo Parts USA

USA . 3,202 parts In-Stock

1+ parts

$1.768

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3,202

$1.768

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Component Stockers USA

USA . 1,492 parts In-Stock

1+ parts

$1.870

100+ parts

$1.760

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$1.580

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1,492

$1.870

$1.760

$1.580

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Microchip USA

USA . 7,063 parts In-Stock

1+ parts

$11.310

100+ parts

$11.240

1k+ parts

$11.210

10k+ parts

$11.170

7,063

$11.310

$11.240

$11.210

$11.170

A-Z Elektronik GmbH

Germany . 5,150 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,433 parts In-Stock

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Perfect Parts

USA . 2,249 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Experience the power of seamless performance with the IRG4PC30FPBF by Infineon Technologies. Crafted with precision and reliability, this Insulated Gate Bipolar Transistor (IGBT) is designed to elevate your power control applications to new heights. From its N-CHANNEL configuration to its high maximum collector-emitter voltage of 600V, this transistor delivers unparalleled efficiency and durability. Whether you're looking to optimize your industrial systems or enhance your renewable energy solutions, the IRG4PC30FPBF provides the value, benefits, and advantages you need to stay ahead of the curve. Elevate your technology with this cutting-edge component today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides good insulation properties, making it suitable for power control applications.

Polarity or Channel Type

N-CHANNEL - N-channel IGBTs typically have lower on-state voltage drop, leading to higher efficiency in power control applications.

Configuration

SINGLE - Single configuration simplifies circuit design and reduces complexity in power control systems.

Transistor Application

POWER CONTROL - Designed specifically for power control applications, ensuring optimal performance and reliability.

Package Shape

RECTANGULAR - Rectangular shape allows for easy mounting and integration into power control systems.

Terminal Form

THROUGH-HOLE - Through-hole terminals provide strong mechanical connections, ideal for high-power applications.

Maximum Fall Time (tf)

270 ns - Fast fall time allows for quick switching between on and off states, enhancing overall system response time.

Nominal Turn Off Time (toff)

640 ns - Longer turn-off time reduces the risk of voltage spikes and improves the stability of power control systems.

No. of Terminals

3 - Three terminals provide simple connectivity and compatibility with standard power control circuits.

Maximum Power Dissipation (Abs)

100 W - High power dissipation capability allows for the handling of large power loads without overheating.

Package Style (Meter)

FLANGE MOUNT - Flange mount design enables secure attachment and heat dissipation in power control applications.

Maximum Operating Temperature

150 °C - High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Maximum Collector-Emitter Voltage

600 V - High voltage rating enables the handling of large voltages in power control applications.

Transistor Element Material

SILICON - Silicon material offers high temperature tolerance and durability for long-term usage in power control systems.

Maximum Collector Current (IC)

31 A - High collector current rating allows for the handling of high current loads in power control applications.

Terminal Finish

MATTE TIN OVER NICKEL - Matte tin over nickel finish provides corrosion resistance and ensures stable electrical connections in power control systems.

Terminal Position

SINGLE - Single terminal position simplifies installation and reduces the risk of wiring errors in power control applications.

Case Connection

COLLECTOR - Collector case connection facilitates efficient heat dissipation and protects the transistor in power control applications.

Nominal Turn On Time (ton)

36 ns - Fast turn-on time enables rapid response to control signals, enhancing the efficiency of power control systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC30FPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

270 ns

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

640 ns

Nominal Turn On Time (ton):

36 ns

Trade Compliance

IRG4PC30FPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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