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IRG4BC40UPBF

Infineon Technologies

IRG4BC40UPBF by Infineon Technologies

IRG4BC40UPBF by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 40A max collector current, and 160W max power dissipation. Ideal for power control applications, it has a single configuration in a rectangular package with through-hole terminals. Operating temperature ranges from -55 to 150°C.

Median Price

$1.750

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 32 parts In-Stock

1+ parts

$2.090

100+ parts

$1.450

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$1.290

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32

$2.090

$1.450

$1.290

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Rochester

USA . 64 parts In-Stock

1+ parts

-

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$1.750

1k+ parts

$1.560

10k+ parts

$1.470

64

-

$1.750

$1.560

$1.470

Verical

USA . 32 parts In-Stock

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-

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$1.630

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32

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$1.630

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Distributors (In-Stock)

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Digiode

USA . 200 parts In-Stock

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$1.843

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$1.843

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Nova Conductors

Japan . 69 parts In-Stock

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$1.931

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69

$1.931

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Voyager Components

USA . 385 parts In-Stock

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$12.650

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385

$12.650

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First Choice Components Inc.

USA . 253 parts In-Stock

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Chip Stock

USA . 154 parts In-Stock

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Vyrian

USA . 110 parts In-Stock

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PC Components Company LLC

USA . 41 parts In-Stock

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Prism Electronics

USA . 23 parts In-Stock

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Bristol Electronics

USA . 15 parts In-Stock

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Speed Components Ltd

Israel . 8 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 15 parts In-Stock

1+ parts

$0.343

100+ parts

-

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15

$0.343

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Modulus Dynamics

Lithuania . 13,862 parts In-Stock

1+ parts

$0.450

100+ parts

$0.432

1k+ parts

$0.414

10k+ parts

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13,862

$0.450

$0.432

$0.414

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Aztec Data Supply Inc.

USA . 4,636 parts In-Stock

1+ parts

$1.100

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4,636

$1.100

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Ampacity Inc.

Singapore . 150 parts In-Stock

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$1.390

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150

$1.390

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Semicontronic

India . 150 parts In-Stock

1+ parts

$1.390

100+ parts

$1.355

1k+ parts

$1.348

10k+ parts

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150

$1.390

$1.355

$1.348

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Corphita

USA . 365 parts In-Stock

1+ parts

$1.746

100+ parts

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365

$1.746

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$1.765

100+ parts

$1.765

1k+ parts

$1.765

10k+ parts

-

2,500

$1.765

$1.765

$1.765

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Argo Parts USA

USA . 3,780 parts In-Stock

1+ parts

$1.931

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3,780

$1.931

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Continental Prestige Electronics

USA . 2,848 parts In-Stock

1+ parts

$1.931

100+ parts

-

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$1.892

2,848

$1.931

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-

$1.892

Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$1.931

100+ parts

$1.834

1k+ parts

$1.743

10k+ parts

$1.719

800

$1.931

$1.834

$1.743

$1.719

Component Stockers USA

USA . 503 parts In-Stock

1+ parts

$1.970

100+ parts

$1.840

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503

$1.970

$1.840

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AZTECH Wire

Italy . 530 parts In-Stock

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$10.277

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530

$10.277

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Microchip USA

USA . 6,764 parts In-Stock

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$12.090

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6,764

$12.090

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Perfect Parts

USA . 20,395 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,671 parts In-Stock

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RC Electronics

USA . 14,755 parts In-Stock

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$1.820

1k+ parts

$1.710

10k+ parts

$1.680

14,755

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$1.820

$1.710

$1.680

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,404 parts In-Stock

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3,404

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Metaverse IC Inc.

Canada . 478 parts In-Stock

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Assy Fe

Spain . 50 parts In-Stock

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Overview

Experience unparalleled power control with the Infineon Technologies IRG4BC40UPBF Insulated Gate Bipolar Transistor. Designed with high-quality materials and cutting-edge technology, this N-channel transistor offers reliable performance in a variety of applications. From industrial machinery to renewable energy systems, this single-configured transistor provides exceptional value and efficiency. Trust in the superior quality and advantages of Infineon Technologies to elevate your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides good insulation and protection for the transistor, ensuring reliable performance and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and makes it easier to integrate the IGBT into various systems.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency in controlling power circuits.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into different types of systems or devices.

Maximum Fall Time (tf): 180 ns

Fast fall time of 180 ns ensures quick switching and efficient power control.

Nominal Turn Off Time (toff): 380 ns

Relatively low turn off time of 380 ns helps in reducing switching losses and improving overall efficiency.

No. of Terminals: 3

Having 3 terminals allows for easy connection and integration into circuits or systems.

Maximum Power Dissipation (Abs): 160 W

High power dissipation capability of 160 W makes this IGBT suitable for handling high power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides a secure and stable installation in various setups.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150°C ensures stable performance even in elevated temperature conditions.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating of 600 V allows for reliable operation in high voltage applications.

Transistor Element Material: SILICON

Silicon material offers good electrical properties and durability, ensuring long-term reliability.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating of 20 V ensures reliable control and protection for the transistor.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55°C allows for operation in cold environments without any issues.

Maximum Collector Current (IC): 40 A

High collector current rating of 40 A allows for handling large currents in power control applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage of 6 V ensures efficient switching and control of the transistor.

Terminal Position: SINGLE

Single terminal position simplifies the connection and integration process in circuit designs.

Case Connection: COLLECTOR

Collector case connection provides a direct connection for the collector terminal, ensuring efficient current flow.

Nominal Turn On Time (ton): 49 ns

Fast turn on time of 49 ns allows for quick activation and response in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC40UPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

ULTRA FAST SWITCHING

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

180 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

380 ns

Nominal Turn On Time (ton):

49 ns

Trade Compliance

IRG4BC40UPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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