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IRG4PC30UDPBF

Infineon Technologies

IRG4PC30UDPBF by Infineon Technologies

IRG4PC30UDPBF by Infineon Technologies is an N-CHANNEL IGBT with a max VCEsat of 2.1V and a max IC of 23A. It is designed for POWER CONTROL applications, featuring a single configuration with built-in diode and a package style of FLANGE MOUNT. Operating temperature ranges from -55 to 150 °C.

Median Price

$3.848

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 79 parts In-Stock

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R&J Components

USA . 1,675 parts In-Stock

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Vyrian

USA . 995 parts In-Stock

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Digiode

USA . 408 parts In-Stock

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Chip Stock

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Connector Distribution Corp

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Right Parts Inc.

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 24,244 parts In-Stock

1+ parts

$0.593

100+ parts

$0.569

1k+ parts

$0.546

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24,244

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Corohmni

South Africa . 102 parts In-Stock

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$0.629

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Aztec Data Supply Inc.

USA . 5,758 parts In-Stock

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$1.066

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$1.913

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$1.724

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Argo Parts USA

USA . 2,998 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 354 parts In-Stock

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AZTECH Wire

Italy . 682 parts In-Stock

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$6.156

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Ampacity Inc.

Singapore . 1,510 parts In-Stock

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$21.050

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Semicontronic

India . 1,489 parts In-Stock

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$55.050

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$53.674

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$53.398

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Perfect Parts

USA . 9,162 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 703 parts In-Stock

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Corphita

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Microchip USA

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Assy Fe

Spain . 30 parts In-Stock

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ChipstoGo Electronic ltd

UK . 20 parts In-Stock

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Overview

Unlock the power of efficient and reliable power control with the IRG4PC30UDPBF from Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and performance in their Insulated Gate Bipolar Transistors. Ideal for applications requiring high power dissipation, this N-Channel transistor offers a built-in diode for added convenience. With a maximum collector-emitter voltage of 600V and a nominal turn-on time of just 61ns, this transistor is a game-changer for your power control needs. Experience seamless operation and enhanced efficiency with the IRG4PC30UDPBF.

Feature Benefit Bullets

Package Body Material

The plastic/epoxy body material provides durability and protection for the components inside, ensuring a longer lifespan for the IGBT.

Polarity or Channel Type

N-channel IGBTs typically have lower on-state resistance and higher efficiency, making them suitable for high power applications.

Maximum Power Dissipation (Abs)

With a maximum power dissipation of 100W, this IGBT can handle high power loads effectively without overheating.

Maximum Collector-Emitter Voltage

The high maximum collector-emitter voltage of 600V makes this IGBT suitable for use in high voltage applications.

Maximum Collector Current (IC)

With a maximum collector current of 23A, this IGBT can handle high current levels, making it suitable for power control applications.

Maximum Operating Temperature

The high maximum operating temperature of 150°C allows this IGBT to operate efficiently in high temperature environments.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC30UDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

130 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

270 ns

Nominal Turn Off Time (toff):

171 ns

Nominal Turn On Time (ton):

61 ns

Maximum VCEsat:

2.1 V

Trade Compliance

IRG4PC30UDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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