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IRG4PC50FDPBF

Infineon Technologies

IRG4PC50FDPBF by Infineon Technologies

IRG4PC50FDPBF by Infineon Technologies is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max power dissipation of 200W. It has a single configuration with built-in diode, suitable for power control applications. With a nominal turn-off time of 660ns and max fall time of 210ns, it offers efficient switching performance in high-power systems.

Median Price

$6.232

Lifecycle Status

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8

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Digiode

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Chip Stock

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ComSIT Distribution GmbH

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Prism Electronics

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Aztec Data Supply Inc.

USA . 814 parts In-Stock

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$0.860

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Modulus Dynamics

Lithuania . 16,605 parts In-Stock

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$5.084

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$4.872

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Corohmni

South Africa . 59 parts In-Stock

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Continental Prestige Electronics

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Netroflash

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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AZTECH Wire

Italy . 596 parts In-Stock

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Semicontronic

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Ampacity Inc.

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Component Stockers USA

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Argo Parts USA

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Metaverse IC Inc.

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Microchip USA

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Corphita

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Overview

Unleash the power of your electronics with the IRG4PC50FDPBF from Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors that are perfect for power control applications. With a maximum collector-emitter voltage of 600V and a maximum collector current of 70A, this N-channel transistor offers unmatched performance and reliability. Say goodbye to slow response times, as this transistor boasts a nominal turn-on time of just 86 ns. Upgrade your electronics today with the IRG4PC50FDPBF and experience the difference Infineon quality can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the IGBT long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

Offers efficient performance and lower resistance, resulting in improved power control capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and reduces component count, making the IGBT more cost-effective and space-saving.

Transistor Application: POWER CONTROL

Ideal for applications requiring precise control over power consumption and distribution.

Package Shape: RECTANGULAR

Allows for easy integration into existing circuit designs and layouts.

Terminal Form: THROUGH-HOLE

Facilitates easy and secure soldering onto circuit boards, ensuring stable connections.

Maximum Fall Time (tf): 210 ns

Offers fast switching speeds for efficient power control and responsiveness.

Nominal Turn Off Time (toff): 660 ns

Provides reliable turn-off performance for consistent power management.

No. of Terminals: 3

Simplifies installation and connection, reducing the risk of errors and increasing efficiency.

Maximum Power Dissipation (Abs): 200 W

Handles high power loads effectively, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting and heat dissipation, ensuring optimal performance under various conditions.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for use in industrial environments.

Maximum Collector-Emitter Voltage: 600 V

Supports high voltage applications, providing versatility and flexibility in power control.

Transistor Element Material: SILICON

Ensures reliability and stability in performance, making the IGBT a durable choice.

Maximum Collector Current (IC): 70 A

Handles high current loads with ease, making it suitable for power-intensive applications.

Terminal Finish: MATTE TIN OVER NICKEL

Provides a reliable and durable finish for long-term usage.

Terminal Position: SINGLE

Simplifies installation and connection, reducing the risk of errors and improving efficiency.

Case Connection: COLLECTOR

Facilitates easy integration into circuit designs for seamless power control.

Nominal Turn On Time (ton): 86 ns

Offers quick turn-on response for efficient power management and control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PC50FDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

ULTRA FAST SOFT RECOVERY

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

210 ns

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

660 ns

Nominal Turn On Time (ton):

86 ns

Trade Compliance

IRG4PC50FDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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