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NGTB40N120S3WG

Onsemi

NGTB40N120S3WG by Onsemi

NGTB40N120S3WG by Onsemi is an N-CHANNEL IGBT with 1200V VCE, 160A IC, and 1.95V VCEsat. Ideal for POWER CONTROL applications due to its high power dissipation of 454W and operating temperature range of -55 to 175°C. Package style is FLANGE MOUNT with PLASTIC/EPOXY body material.

Median Price

$5.510

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,590 parts In-Stock

1+ parts

$3.280

100+ parts

$3.080

1k+ parts

$2.790

10k+ parts

-

1,590

$3.280

$3.080

$2.790

-

Farnell

UK . 61 parts In-Stock

1+ parts

$5.510

100+ parts

-

1k+ parts

-

10k+ parts

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61

$5.510

-

-

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Element14

Singapore . 172 parts In-Stock

1+ parts

$8.660

100+ parts

$5.370

1k+ parts

$4.420

10k+ parts

-

172

$8.660

$5.370

$4.420

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 315 parts In-Stock

1+ parts

$3.116

100+ parts

-

1k+ parts

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315

$3.116

-

-

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Nova Conductors

Japan . 28 parts In-Stock

1+ parts

$3.593

100+ parts

-

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28

$3.593

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-

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Vyrian

USA . 4,287 parts In-Stock

1+ parts

-

100+ parts

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4,287

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,171 parts In-Stock

1+ parts

$1.180

100+ parts

-

1k+ parts

-

10k+ parts

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1,171

$1.180

-

-

-

Semicontronic

India . 302 parts In-Stock

1+ parts

$2.790

100+ parts

$2.720

1k+ parts

$2.706

10k+ parts

-

302

$2.790

$2.720

$2.706

-

Ampacity Inc.

Singapore . 141 parts In-Stock

1+ parts

$2.790

100+ parts

-

1k+ parts

-

10k+ parts

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141

$2.790

-

-

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Corphita

USA . 536 parts In-Stock

1+ parts

$2.952

100+ parts

-

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536

$2.952

-

-

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Corohmni

South Africa . 462 parts In-Stock

1+ parts

$3.280

100+ parts

-

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10k+ parts

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462

$3.280

-

-

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$3.593

100+ parts

$3.413

1k+ parts

$3.243

10k+ parts

$3.198

50

$3.593

$3.413

$3.243

$3.198

Continental Prestige Electronics

USA . 3,572 parts In-Stock

1+ parts

$3.593

100+ parts

-

1k+ parts

-

10k+ parts

$3.522

3,572

$3.593

-

-

$3.522

Argo Parts USA

USA . 94 parts In-Stock

1+ parts

$3.593

100+ parts

-

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94

$3.593

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$10.340

100+ parts

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276

$10.340

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Problanco Electronics

Mexico . 8,273 parts In-Stock

1+ parts

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8,273

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Kulean Microsystems

USA . 7,728 parts In-Stock

1+ parts

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7,728

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TANS Electronics

Latvia . 5,641 parts In-Stock

1+ parts

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5,641

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SupplyDigital Components

Austria . 4,702 parts In-Stock

1+ parts

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4,702

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,500

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UHIMA Technologies

Türkiye . 832 parts In-Stock

1+ parts

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100+ parts

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832

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Overview

Experience the next level of power control with the NGTB40N120S3WG by Onsemi, a top-tier manufacturer known for quality and innovation. This Insulated Gate Bipolar Transistor (IGBT) with N-Channel configuration offers unparalleled performance in various applications, from industrial to automotive. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 160A, this transistor provides reliable and efficient power control solutions. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package ensures durability and protection for the internal components of the IGBT, making it resistant to environmental factors and mechanical stress.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them suitable for power control applications where precision and speed are critical.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to prevent reverse current flow and provides additional protection to the circuit, making this IGBT a reliable choice for power control applications.

Maximum VCEsat: 1.95 V

The low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to lower power dissipation and increased efficiency in power control applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation in various electronic devices and systems, making it versatile and user-friendly.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and reliable connections, ensuring stable performance and minimizing the risk of signal loss or disconnection.

Maximum Power Dissipation (Abs): 454 W

With a high maximum power dissipation rating, this IGBT can handle heavy loads and operate at high power levels without overheating, ensuring long-term reliability and performance.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature tolerance allows the IGBT to withstand extreme heat conditions, making it suitable for industrial and high-temperature environments.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating enables the IGBT to handle high voltage levels safely, making it ideal for power control applications that require voltage regulation and protection.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its reliability and efficiency, making it a preferred choice for IGBTs in power control applications.

Maximum Gate-Emitter Voltage: 20 V

The high maximum gate-emitter voltage rating allows for precise control over the IGBT's switching behavior, ensuring stable and accurate performance in power control applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature tolerance enables the IGBT to function effectively in cold environments, providing consistent performance even in extreme temperature conditions.

Maximum Collector Current (IC): 160 A

With a high maximum collector current rating, this IGBT can handle large currents efficiently, making it suitable for power control applications that require high current handling capabilities.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The moderate gate-emitter threshold voltage ensures smooth and reliable operation of the IGBT, allowing for precise control and efficient switching in power control applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish provides corrosion resistance and ensures secure connections, enhancing the overall durability and longevity of the IGBT in various operating conditions.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection of the IGBT in electronic circuits, reducing complexity and making it easier to integrate into different applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB40N120S3WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

1.95 V

Trade Compliance

NGTB40N120S3WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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