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NGTB30N120IHSWG

Onsemi

NGTB30N120IHSWG by Onsemi

NGTB30N120IHSWG by Onsemi is an N-CHANNEL IGBT with 192W power dissipation, 1200V collector-emitter voltage, and 60A collector current. Ideal for high-power applications requiring efficient switching capabilities at up to 150°C operating temperature.

Median Price

$1.935

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 5,392 parts In-Stock

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$1.990

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$1.990

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Rochester

USA . 5,342 parts In-Stock

1+ parts

-

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$1.700

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$1.520

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$1.430

5,342

-

$1.700

$1.520

$1.430

DigiKey

USA . 5,342 parts In-Stock

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$1.970

10k+ parts

$1.970

5,342

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$1.970

$1.970

Verical

USA . 4,254 parts In-Stock

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$1.900

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4,254

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$1.900

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Distributors (In-Stock)

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Digiode

USA . 2,372 parts In-Stock

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$1.796

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2,372

$1.796

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Nova Conductors

Japan . 82 parts In-Stock

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$1.850

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82

$1.850

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Vyrian

USA . 4,873 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,004 parts In-Stock

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$1.610

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5,004

$1.610

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Corphita

USA . 807 parts In-Stock

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$1.701

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807

$1.701

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Corohmni

South Africa . 81 parts In-Stock

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$1.776

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81

$1.776

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Argo Parts USA

USA . 4,118 parts In-Stock

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$1.850

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$1.850

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Microchip USA

USA . 6,126 parts In-Stock

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$11.765

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Problanco Electronics

Mexico . 5,421 parts In-Stock

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Continental Prestige Electronics

USA . 5,342 parts In-Stock

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$1.810

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$1.810

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SupplyDigital Components

Austria . 5,229 parts In-Stock

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TANS Electronics

Latvia . 1,534 parts In-Stock

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Kulean Microsystems

USA . 1,115 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 98 parts In-Stock

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98

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Bastille Electronics

Australia . 20 parts In-Stock

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20

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Overview

Unleash the power of innovation with the NGTB30N120IHSWG by Onsemi, a top-tier manufacturer known for delivering cutting-edge technology. As a leading player in the Insulated Gate Bipolar Transistors (IGBT) category, this N-CHANNEL transistor offers unmatched quality and reliability. Ideal for a wide range of applications, this product guarantees superior performance in demanding environments. Elevate your projects with the value, benefits, and advantages that only Onsemi can provide. Experience the difference with the NGTB30N120IHSWG and unlock endless possibilities for success.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs have lower conduction losses and higher efficiency compared to P-channel types, making them a popular choice for high-power applications.

Maximum Power Dissipation (Abs): 192 W

The high maximum power dissipation allows the IGBT to handle large amounts of power without overheating, ensuring reliability in demanding conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature tolerance of 150°C enables the IGBT to operate in high-temperature environments without performance degradation.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating of 1200V makes this IGBT suitable for high voltage applications, providing robustness and reliability.

Maximum Gate-Emitter Voltage: 20 V

The low maximum gate-emitter voltage requirement of 20V simplifies the driver circuit design and enhances the ease of use of the IGBT.

Maximum Collector Current (IC): 60 A

The high maximum collector current rating of 60A allows the IGBT to handle large current flows, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The low gate-emitter threshold voltage of 6.5V results in faster switching speeds and lower conduction losses, improving overall efficiency.

Terminal Finish: TIN

The TIN terminal finish ensures good electrical connections and reliability, contributing to the long-term performance and durability of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB30N120IHSWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Trade Compliance

NGTB30N120IHSWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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