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NGTB40N120FLWG

Onsemi

NGTB40N120FLWG by Onsemi

NGTB40N120FLWG by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 80A max collector current, and 260W max power dissipation. Ideal for power control applications, it features a built-in diode, 630ns turn-off time, and operates up to 150°C.

Median Price

$3.430

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,120 parts In-Stock

1+ parts

$3.430

100+ parts

$3.360

1k+ parts

$3.290

10k+ parts

-

16,120

$3.430

$3.360

$3.290

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.880

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$2.880

-

-

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Vyrian

USA . 6,068 parts In-Stock

1+ parts

-

100+ parts

-

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6,068

-

-

-

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Digiode

USA . 257 parts In-Stock

1+ parts

-

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257

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 300 parts In-Stock

1+ parts

$0.530

100+ parts

-

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-

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300

$0.530

-

-

-

Corohmni

South Africa . 51 parts In-Stock

1+ parts

$2.766

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-

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-

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51

$2.766

-

-

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Argo Parts USA

USA . 2,901 parts In-Stock

1+ parts

$2.880

100+ parts

-

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2,901

$2.880

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Continental Prestige Electronics

USA . 2,115 parts In-Stock

1+ parts

$2.880

100+ parts

-

1k+ parts

-

10k+ parts

$2.822

2,115

$2.880

-

-

$2.822

Ampacity Inc.

Singapore . 1,487 parts In-Stock

1+ parts

$4.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,487

$4.050

-

-

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AZTECH Wire

Italy . 718 parts In-Stock

1+ parts

$8.804

100+ parts

-

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718

$8.804

-

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Semicontronic

India . 314 parts In-Stock

1+ parts

$13.050

100+ parts

$12.724

1k+ parts

$12.658

10k+ parts

-

314

$13.050

$12.724

$12.658

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Kulean Microsystems

USA . 6,827 parts In-Stock

1+ parts

-

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6,827

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A-Z Elektronik GmbH

Germany . 4,670 parts In-Stock

1+ parts

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4,670

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TANS Electronics

Latvia . 4,501 parts In-Stock

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4,501

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-

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Problanco Electronics

Mexico . 2,993 parts In-Stock

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2,993

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$2.822

1k+ parts

$2.736

10k+ parts

$2.678

2,000

-

$2.822

$2.736

$2.678

SupplyDigital Components

Austria . 1,154 parts In-Stock

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1,154

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Corphita

USA . 950 parts In-Stock

1+ parts

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950

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UHIMA Technologies

Türkiye . 183 parts In-Stock

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183

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Overview

Enhance your power control applications with the NGTB40N120FLWG by Onsemi, a high-quality Insulated Gate Bipolar Transistor that offers reliability and efficiency. With a single configuration and built-in diode, this transistor is designed for seamless operation. Whether you're looking to optimize power management or improve system performance, this product delivers exceptional value and benefits. Trust in Onsemi's expertise in semiconductor manufacturing to provide you with a top-of-the-line solution for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Helps in reducing weight and cost of the product while maintaining durability and insulation properties.

Polarity or Channel Type: N-CHANNEL

Provides efficient power control and switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Transistor Application: POWER CONTROL

Suitable for applications requiring precise power control capabilities.

Package Shape: RECTANGULAR

Allows for easy integration into circuits and PCB designs.

Nominal Turn Off Time (toff): 630 ns

Provides fast switching speed for efficient power control.

No. of Terminals: 3

Simplifies the connection process and reduces complexity in circuit design.

Maximum Power Dissipation (Abs): 260 W

Capable of handling high power levels while maintaining operational efficiency.

Package Style (Meter): FLANGE MOUNT

Allows for easy and secure mounting in various applications.

Maximum Operating Temperature: 150 °C

Can operate reliably in high-temperature environments.

Maximum Collector-Emitter Voltage: 1200 V

Suitable for high voltage applications.

Transistor Element Material: SILICON

Provides reliable performance and durability.

Maximum Gate-Emitter Voltage: 20 V

Ensures safe and reliable operation within specified voltage limits.

Maximum Collector Current (IC): 80 A

Capable of handling high currents for power control applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Ensures proper gate control for efficient power switching.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: SINGLE

Simplifies installation and connection process.

Case Connection: COLLECTOR

Helps in efficient dissipation of heat generated during operation.

Nominal Turn On Time (ton): 172 ns

Provides fast turn-on time for quick power control response.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB40N120FLWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

630 ns

Nominal Turn On Time (ton):

172 ns

Trade Compliance

NGTB40N120FLWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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