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NGTB40N120SWG

Onsemi

NGTB40N120SWG by Onsemi

The Onsemi NGTB40N120SWG is an N-CHANNEL IGBT with VCEsat of 2.4V and IC of 80A, ideal for POWER CONTROL applications. It has a max VCE of 1200V, turn-off time of 564ns, and power dissipation of 535W. The transistor operates b/w -55 to 175 °C and features a built-in diode in a RECTANGULAR package with THROUGH-HOLE terminals.

Median Price

$2.190

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.840

10

-

$2.190

$1.960

$1.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,561 parts In-Stock

1+ parts

$2.308

100+ parts

-

1k+ parts

-

10k+ parts

-

1,561

$2.308

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.662

100+ parts

-

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500

$2.662

-

-

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Vyrian

USA . 8,173 parts In-Stock

1+ parts

-

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8,173

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,107 parts In-Stock

1+ parts

$0.517

100+ parts

-

1k+ parts

-

10k+ parts

-

2,107

$0.517

-

-

-

Andel Nordic

Denmark . 5,885 parts In-Stock

1+ parts

$0.880

100+ parts

-

1k+ parts

$0.613

10k+ parts

$0.613

5,885

$0.880

-

$0.613

$0.613

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

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-

10

$2.070

-

-

-

Corphita

USA . 613 parts In-Stock

1+ parts

$2.187

100+ parts

-

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-

10k+ parts

-

613

$2.187

-

-

-

Corohmni

South Africa . 105 parts In-Stock

1+ parts

$2.430

100+ parts

-

1k+ parts

-

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-

105

$2.430

-

-

-

Argo Parts USA

USA . 2,546 parts In-Stock

1+ parts

$2.662

100+ parts

-

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-

10k+ parts

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2,546

$2.662

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-

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Continental Prestige Electronics

USA . 2,461 parts In-Stock

1+ parts

$2.662

100+ parts

-

1k+ parts

-

10k+ parts

$2.609

2,461

$2.662

-

-

$2.609

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.662

100+ parts

-

1k+ parts

$2.529

10k+ parts

$2.476

1,000

$2.662

-

$2.529

$2.476

AZTECH Wire

Italy . 463 parts In-Stock

1+ parts

$11.784

100+ parts

-

1k+ parts

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463

$11.784

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-

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RC Electronics

USA . 46,613 parts In-Stock

1+ parts

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46,613

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SupplyDigital Components

Austria . 7,328 parts In-Stock

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7,328

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A-Z Elektronik GmbH

Germany . 5,366 parts In-Stock

1+ parts

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5,366

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TANS Electronics

Latvia . 5,286 parts In-Stock

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5,286

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Problanco Electronics

Mexico . 2,855 parts In-Stock

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2,855

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Kepictronics

USA . 1,435 parts In-Stock

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1,435

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Kulean Microsystems

USA . 1,155 parts In-Stock

1+ parts

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1,155

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UHIMA Technologies

Türkiye . 619 parts In-Stock

1+ parts

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619

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Overview

Unlock the power of precision with the NGTB40N120SWG by Onsemi. As a leader in the manufacturing of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers top-notch quality and reliability. This single N-CHANNEL transistor with a built-in diode is perfect for power control applications, offering a maximum VCEsat of 2.4V and a maximum operating temperature of 175°C. With a maximum collector-emitter voltage of 1200V and a maximum collector current of 80A, this transistor provides unparalleled performance and efficiency. Trust Onsemi to provide cutting-edge technology that meets all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and is lightweight, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drop and faster switching speeds compared to P-CHANNEL types.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easy implementation of protection circuits and simplifies the overall design.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable performance.

Maximum VCEsat: 2.4 V

Low VCEsat helps reduce power loss and improves efficiency in power control applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and space-saving integration into PCB designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering on PCBs.

Nominal Turn Off Time (toff): 564 ns

Fast turn-off time helps minimize switching losses and improve overall efficiency.

No. of Terminals: 3

Simplified three-terminal design for easy integration and connection in circuits.

Maximum Power Dissipation (Abs): 535 W

High power dissipation capability makes it suitable for handling high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides additional mechanical support and heat dissipation capabilities.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for use in various environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High maximum voltage rating enables the IGBT to be used in high-voltage applications.

Transistor Element Material: SILICON

Silicon material provides good performance characteristics and reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures reliable and stable operation of the IGBT.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for reliable operation in extreme cold conditions.

Maximum Collector Current (IC): 80 A

High collector current rating makes it suitable for handling high current loads in power control applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Low gate-emitter threshold voltage ensures easy and efficient switching of the IGBT.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and reliability in electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and integration into PCB layouts.

Nominal Turn On Time (ton): 154 ns

Fast turn-on time helps improve switching speed and overall performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB40N120SWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

564 ns

Nominal Turn On Time (ton):

154 ns

Maximum VCEsat:

2.4 V

Trade Compliance

NGTB40N120SWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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