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FPF2C110BI07AS2

Onsemi

FPF2C110BI07AS2 by Onsemi

Onsemi's FPF2C110BI07AS2 is an N-CHANNEL IGBT for POWER CONTROL applications. It features a Max VCEsat of 2.3V, Nominal Turn Off Time of 152ns, and Max Collector-Emitter Voltage of 650V. This COMPLEX transistor with 6 elements operates b/w -40 to 150 °C and has a Max Power Dissipation of 158W in a RECTANGULAR package style.

Median Price

$74.844

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,050 parts In-Stock

1+ parts

-

100+ parts

$58.750

1k+ parts

$52.560

10k+ parts

$49.470

1,050

-

$58.750

$52.560

$49.470

DigiKey

USA . 1,050 parts In-Stock

1+ parts

-

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1,050

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Verical

USA . 1,050 parts In-Stock

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-

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$90.938

1k+ parts

$81.362

10k+ parts

$76.575

1,050

-

$90.938

$81.362

$76.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$72.250

100+ parts

-

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50

$72.250

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Digiode

USA . 1,231 parts In-Stock

1+ parts

$76.978

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1,231

$76.978

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DigiKey Marketplace

USA . 1,050 parts In-Stock

1+ parts

$84.270

100+ parts

-

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1,050

$84.270

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Vyrian

USA . 8,573 parts In-Stock

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8,573

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Distributors (Availability)

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Ampacity Inc.

Singapore . 840 parts In-Stock

1+ parts

$68.880

100+ parts

-

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840

$68.880

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-

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Corohmni

South Africa . 454 parts In-Stock

1+ parts

$70.805

100+ parts

-

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454

$70.805

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Continental Prestige Electronics

USA . 1,391 parts In-Stock

1+ parts

$72.250

100+ parts

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$70.805

1,391

$72.250

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$70.805

Netroflash

USA . 100 parts In-Stock

1+ parts

$72.250

100+ parts

$70.805

1k+ parts

-

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100

$72.250

$70.805

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Corphita

USA . 2,299 parts In-Stock

1+ parts

$72.927

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2,299

$72.927

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Microchip USA

USA . 8,421 parts In-Stock

1+ parts

$178.917

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8,421

$178.917

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Lixinc

USA . 17,833 parts In-Stock

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17,833

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QUARKTWIN TECHNOLOGY LTD

USA . 13,108 parts In-Stock

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SupplyDigital Components

Austria . 7,971 parts In-Stock

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7,971

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Kulean Microsystems

USA . 6,690 parts In-Stock

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6,690

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Problanco Electronics

Mexico . 6,136 parts In-Stock

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6,136

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Argo Parts USA

USA . 3,731 parts In-Stock

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3,731

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TANS Electronics

Latvia . 2,278 parts In-Stock

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2,278

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UHIMA Technologies

Türkiye . 602 parts In-Stock

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602

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Overview

Discover the power and efficiency of the FPF2C110BI07AS2 by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor perfect for power control applications. With a maximum VCEsat of 2.3V and a maximum collector-emitter voltage of 650V, this N-channel transistor offers unparalleled performance and reliability. Boasting a package style of flange mount and a maximum power dissipation of 158W, this complex configuration transistor is designed to exceed expectations. Trust in Onsemi's legacy of quality and innovation and elevate your projects with the FPF2C110BI07AS2 today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs provide better performance compared to P-CHANNEL IGBTs in high-power applications.

Configuration: COMPLEX

Complex configuration allows for versatile use in various power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency.

Maximum VCEsat: 2.3 V

Low VCEsat value indicates lower power dissipation and higher efficiency in operation.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy installation and compact design.

No. of Elements: 6

Having 6 elements provides higher power handling capacity and better performance in complex applications.

Nominal Turn Off Time (toff): 152 ns

Fast turn-off time ensures quick response and reliable operation in switching applications.

No. of Terminals: 30

Higher number of terminals allow for more connectivity options and flexibility in circuit design.

Maximum Power Dissipation (Abs): 158 W

High power dissipation capability enables the product to handle significant power loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure mounting and effective heat dissipation.

Maximum Operating Temperature: 150 °C

Wide operating temperature range ensures reliable performance even in harsh environments.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating allows for handling high voltage loads in power control applications.

Transistor Element Material: SILICON

Silicon material provides high stability and efficiency in operation.

Maximum Gate-Emitter Voltage: 20 V

Gate-emitter voltage rating ensures safe and reliable operation within specified limits.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of environments.

Maximum Collector Current (IC): 40 A

High collector current rating enables the product to handle high power loads with ease.

Maximum Gate-Emitter Threshold Voltage: 6.1 V

Gate-emitter threshold voltage ensures proper turn-on and turn-off operation of the transistor.

Terminal Position: UPPER

Upper terminal position offers convenient connectivity options in circuit layouts.

Case Connection: ISOLATED

Isolated case connection enhances safety and reliability in operation by preventing electrical interference.

Nominal Turn On Time (ton): 49 ns

Fast turn-on time allows for quick response and precise control in power switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FPF2C110BI07AS2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.1 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X30

No. of Elements:

6

No. of Terminals:

30

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

152 ns

Nominal Turn On Time (ton):

49 ns

Maximum VCEsat:

2.3 V

Trade Compliance

FPF2C110BI07AS2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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