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FPF2G75FH07BP

Onsemi

FPF2G75FH07BP by Onsemi

FPF2G75FH07BP by Onsemi is an N-CHANNEL IGBT with 6 elements, VCEsat of 2.2V, and IC of 75A. Ideal for POWER CONTROL applications, it has a toff of 462ns and ton of 124ns. Operating b/w -40 °C to 150°C, it offers a max VCE of 650V and Pabs of 236W in a RECTANGULAR package style.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,611 parts In-Stock

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Digiode

USA . 2,243 parts In-Stock

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Native Components

USA . 392 parts In-Stock

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$0.174

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$0.167

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$0.167

Northwest PG Solutions

USA . 1,047 parts In-Stock

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$0.191

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$0.168

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AZTECH Wire

Italy . 660 parts In-Stock

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SupplyDigital Components

Austria . 6,714 parts In-Stock

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TANS Electronics

Latvia . 4,238 parts In-Stock

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Corphita

USA . 2,358 parts In-Stock

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Kulean Microsystems

USA . 1,334 parts In-Stock

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Problanco Electronics

Mexico . 1,045 parts In-Stock

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Corohmni

South Africa . 299 parts In-Stock

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UHIMA Technologies

Türkiye . 266 parts In-Stock

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Microchip USA

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Overview

Unleash the power of innovation with the FPF2G75FH07BP by Onsemi. As a leader in the field of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers top-notch quality and reliability with this N-CHANNEL transistor designed for power control applications. Experience seamless performance and efficiency with its complex configuration, while enjoying the benefits of a maximum VCEsat of 2.2V and a maximum collector current of 75A. Trust Onsemi to provide cutting-edge technology that exceeds expectations, making your projects run smoother and more effectively than ever before.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer lower conduction losses and higher efficiency compared to P-channel IGBTs.

Configuration: COMPLEX

Complex configuration allows for more advanced power control and switching capabilities.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, making it suitable for high-power systems.

Maximum VCEsat: 2.2 V

Low VCEsat helps minimize power losses and improve efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular package shape offers easier mounting and integration into electronic systems.

Nominal Turn Off Time (toff): 462 ns

Fast turn-off time allows for precise control and switching in power applications.

Maximum Power Dissipation (Abs): 236 W

High power dissipation capability enables the IGBT to handle heavy loads and high power levels.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure and stable mounting in various applications.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for reliable performance in different environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

High VCE can handle high voltage levels, making it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon material ensures high thermal conductivity and reliability in power electronics.

Maximum Gate-Emitter Voltage: 25 V

High gate-emitter voltage rating provides robustness and protection against overvoltage conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme cold conditions without performance degradation.

Maximum Collector Current (IC): 75 A

High collector current rating allows the IGBT to handle large current flows in power systems.

Maximum Gate-Emitter Threshold Voltage: 6.8 V

Optimal gate-emitter threshold voltage ensures reliable switching and control in power applications.

Terminal Position: UPPER

Upper terminal position facilitates easy connectivity and integration into power circuits.

Nominal Turn On Time (ton): 124 ns

Fast turn-on time enables quick response and switching in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FPF2G75FH07BP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.8 V

Maximum Gate-Emitter Voltage:

25 V

JESD-30 Code:

R-XUFM-X32

No. of Elements:

6

No. of Terminals:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

462 ns

Nominal Turn On Time (ton):

124 ns

Maximum VCEsat:

2.2 V

Trade Compliance

FPF2G75FH07BP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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