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FPF2G120BF07AS

Onsemi

FPF2G120BF07AS by Onsemi

FPF2G120BF07AS by Onsemi is an N-CHANNEL IGBT with 3 elements, built-in diode, and thermistor. It has a max VCEsat of 2.2V, 165ns turn-off time, and 156W power dissipation. Ideal for power control applications due to its high collector-emitter voltage of 650V and max current of 40A.

Median Price

$100.148

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 980 parts In-Stock

1+ parts

-

100+ parts

$89.020

1k+ parts

$79.650

10k+ parts

$74.970

980

-

$89.020

$79.650

$74.970

DigiKey

USA . 980 parts In-Stock

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-

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980

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Verical

USA . 980 parts In-Stock

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100+ parts

$111.275

1k+ parts

$99.563

10k+ parts

$93.713

980

-

$111.275

$99.563

$93.713

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 637 parts In-Stock

1+ parts

$94.212

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637

$94.212

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Vyrian

USA . 855 parts In-Stock

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$95.581

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855

$95.581

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Distributors (Availability)

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Corphita

USA . 599 parts In-Stock

1+ parts

$89.253

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-

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599

$89.253

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Corohmni

South Africa . 345 parts In-Stock

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$95.581

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345

$95.581

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Continental Prestige Electronics

USA . 980 parts In-Stock

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$119.000

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980

$119.000

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QUARKTWIN TECHNOLOGY LTD

USA . 24,643 parts In-Stock

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24,643

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Problanco Electronics

Mexico . 6,625 parts In-Stock

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6,625

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Kulean Microsystems

USA . 5,929 parts In-Stock

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5,929

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Microchip USA

USA . 4,139 parts In-Stock

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Supply Digital

USA . 1,780 parts In-Stock

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1,780

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TANS Electronics

Latvia . 1,663 parts In-Stock

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1,663

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Northwest PG Solutions

USA . 1,177 parts In-Stock

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UHIMA Technologies

Türkiye . 604 parts In-Stock

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604

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Native Components

USA . 397 parts In-Stock

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397

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SupplyDigital Components

Austria . 269 parts In-Stock

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269

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Overview

Unleash the power of innovation with the FPF2G120BF07AS by Onsemi! As a top-tier manufacturer in the industry, Onsemi delivers unparalleled quality and reliability in their Insulated Gate Bipolar Transistors (IGBTs). This product boasts separate elements with a built-in diode and thermistor, making it perfect for power control applications. With a low VCEsat of 2.2V and maximum operating temperature of 150°C, this IGBT offers exceptional performance and efficiency. Say goodbye to overheating and hello to seamless power management with the FPF2G120BF07AS from Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs offer better performance in high power applications compared to P-CHANNEL IGBTs.

Configuration: SEPARATE, 3 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for enhanced protection and control in power applications.

Maximum VCEsat: 2.2 V

Low VCEsat results in lower power dissipation and higher efficiency in power control applications.

Nominal Turn Off Time (toff): 165 ns

Fast turn off time allows for precise control and switching in power circuits.

Maximum Power Dissipation (Abs): 156 W

High power dissipation capability ensures reliability in demanding power control applications.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating allows for use in high voltage circuits.

Maximum Gate-Emitter Voltage: 20 V

Safe maximum gate-emitter voltage ensures protection of the transistor during operation.

Maximum Collector Current (IC): 40 A

High collector current rating enables handling of large currents in power circuits.

Nominal Turn On Time (ton): 49 ns

Fast turn on time ensures quick response in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FPF2G120BF07AS attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.8 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X32

No. of Elements:

3

No. of Terminals:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

165 ns

Nominal Turn On Time (ton):

49 ns

Maximum VCEsat:

2.2 V

Trade Compliance

FPF2G120BF07AS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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