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FPF2G120BF07ASP

Onsemi

FPF2G120BF07ASP by Onsemi

Onsemi's FPF2G120BF07ASP is an N-CHANNEL IGBT with 3 elements, diode, and thermistor. Ideal for power control applications with VCEsat of 2.2V, IC of 40A, and toff of 165ns. Operates at -40 to 150°C temperature range in a flange mount package style.

Median Price

$80.720

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 630 parts In-Stock

1+ parts

-

100+ parts

$42.080

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630

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$42.080

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Flip Electronics (Authorized)

USA . 630 parts In-Stock

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630

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Rochester

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$87.910

1k+ parts

$78.660

10k+ parts

$74.030

70

-

$87.910

$78.660

$74.030

Arrow

USA . 70 parts In-Stock

1+ parts

-

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$80.720

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70

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$80.720

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Verical

USA . 70 parts In-Stock

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$109.888

1k+ parts

$98.325

10k+ parts

$92.537

70

-

$109.888

$98.325

$92.537

Chip1Stop

Japan . 70 parts In-Stock

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$48.200

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70

-

$48.200

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Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$87.240

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-

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150

$87.240

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Digiode

USA . 491 parts In-Stock

1+ parts

$93.024

100+ parts

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491

$93.024

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Flip Electronics

USA . 630 parts In-Stock

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630

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Vyrian

USA . 103 parts In-Stock

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103

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Bristol Electronics

USA . 70 parts In-Stock

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70

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Dan-Mar Components

USA . 70 parts In-Stock

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70

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Distributors (Availability)

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Ampacity Inc.

Singapore . 217 parts In-Stock

1+ parts

$35.770

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217

$35.770

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Corohmni

South Africa . 203 parts In-Stock

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$42.080

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$42.080

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Continental Prestige Electronics

USA . 1,676 parts In-Stock

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$87.240

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$85.495

1,676

$87.240

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$85.495

Corphita

USA . 1,223 parts In-Stock

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$88.128

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$88.128

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Kulean Microsystems

USA . 5,132 parts In-Stock

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TANS Electronics

Latvia . 4,714 parts In-Stock

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4,714

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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SupplyDigital Components

Austria . 4,282 parts In-Stock

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4,282

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Problanco Electronics

Mexico . 2,960 parts In-Stock

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2,960

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Microchip USA

USA . 2,886 parts In-Stock

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2,886

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Supply Digital

USA . 2,618 parts In-Stock

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2,618

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Argo Parts USA

USA . 1,949 parts In-Stock

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1,949

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UHIMA Technologies

Türkiye . 447 parts In-Stock

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447

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Overview

Elevate your power control capabilities with the FPF2G120BF07ASP by Onsemi. As a leading manufacturer of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers top-notch quality and reliability in every product. This N-CHANNEL transistor with separate, 3 elements design offers built-in diode and thermistor for added convenience. Perfect for applications requiring high power control, this transistor provides a maximum VCEsat of 2.2V and a maximum collector current of 40A. Trust Onsemi to provide exceptional value and performance with the FPF2G120BF07ASP.

Feature Benefit Bullets

Polarity Type: N-CHANNEL

Having a N-CHANNEL polarity allows for efficient power control, making it a good choice for applications requiring high performance.

Configuration: SEPARATE, 3 ELEMENTS

The separate configuration with 3 elements and built-in diode and thermistor provides flexibility and reliability in power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT ensures precise and effective management of power.

Maximum VCEsat: 2.2 V

With a low maximum VCEsat of 2.2 V, this IGBT minimizes power loss and improves overall efficiency in power control applications.

Package Shape: RECTANGULAR

The rectangular package shape offers easy integration and installation, making it a convenient choice for various setups.

Maximum Power Dissipation: 156 W

With a high maximum power dissipation of 156 W, this IGBT can handle power surges and fluctuations effectively.

Package Style: FLANGE MOUNT

The flange mount package style ensures secure mounting and heat dissipation, enhancing the overall performance and longevity of the IGBT.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this IGBT can withstand extreme conditions without compromising performance.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage of 650 V allows for handling high voltages, making it suitable for demanding power control applications.

Transistor Element Material: SILICON

Built with silicon material, this IGBT offers superior conductivity and stability, ensuring reliable performance in power control scenarios.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FPF2G120BF07ASP attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.8 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X32

No. of Elements:

3

No. of Terminals:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

165 ns

Nominal Turn On Time (ton):

49 ns

Maximum VCEsat:

2.2 V

Trade Compliance

FPF2G120BF07ASP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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