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FS100R12KE3BOSA1

Infineon Technologies

FS100R12KE3BOSA1 by Infineon Technologies

FS100R12KE3BOSA1 by Infineon is a N-CHANNEL IGBT with 6 elements in bridge configuration. It has a max voltage of 1200V, current of 140A, and turn off time of 610ns. Ideal for applications requiring high power switching like motor drives and renewable energy systems.

Median Price

$146.610

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2 parts In-Stock

1+ parts

$62.440

100+ parts

-

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-

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2

$62.440

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Farnell

UK . 25 parts In-Stock

1+ parts

$146.610

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-

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25

$146.610

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Arrow

USA . 86 parts In-Stock

1+ parts

$163.608

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86

$163.608

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RS (Exports)

UK . 29 parts In-Stock

1+ parts

$287.447

100+ parts

-

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29

$287.447

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Element14

Singapore . 25 parts In-Stock

1+ parts

$14,199.240

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25

$14,199.240

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Rochester

USA . 102 parts In-Stock

1+ parts

-

100+ parts

$86.450

1k+ parts

$77.350

10k+ parts

$72.800

102

-

$86.450

$77.350

$72.800

DigiKey

USA . 102 parts In-Stock

1+ parts

-

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102

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Verical

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$108.063

1k+ parts

$96.688

10k+ parts

$91.000

100

-

$108.063

$96.688

$91.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 832 parts In-Stock

1+ parts

$103.645

100+ parts

-

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832

$103.645

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$222.393

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10

$222.393

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$258.090

100+ parts

$233.290

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100

$258.090

$233.290

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Vyrian

USA . 3,958 parts In-Stock

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3,958

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NAC Semi

USA . 110 parts In-Stock

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$172.840

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110

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$172.840

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TME

Poland . 86 parts In-Stock

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86

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 25,203 parts In-Stock

1+ parts

$0.829

100+ parts

$0.796

1k+ parts

$0.763

10k+ parts

-

25,203

$0.829

$0.796

$0.763

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Corohmni

South Africa . 653 parts In-Stock

1+ parts

$1.062

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653

$1.062

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Aztec Data Supply Inc.

USA . 57 parts In-Stock

1+ parts

$1.726

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57

$1.726

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AZTECH Wire

Italy . 374 parts In-Stock

1+ parts

$12.875

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374

$12.875

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Ampacity Inc.

Singapore . 19 parts In-Stock

1+ parts

$92.730

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19

$92.730

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Corphita

USA . 770 parts In-Stock

1+ parts

$98.190

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770

$98.190

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Continental Prestige Electronics

USA . 28 parts In-Stock

1+ parts

$162.310

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28

$162.310

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Microchip USA

USA . 3,148 parts In-Stock

1+ parts

$355.950

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3,148

$355.950

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,754 parts In-Stock

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1,754

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$217.945

1k+ parts

$211.273

10k+ parts

$206.825

100

-

$217.945

$211.273

$206.825

Eastek

USA . 10 parts In-Stock

1+ parts

-

100+ parts

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10

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Overview

Unlock the potential of your power electronics with the FS100R12KE3BOSA1 by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors that are reliable, efficient, and versatile. Whether you're designing motor drives, solar inverters, or welding equipment, this N-CHANNEL IGBT with built-in diode and thermistor offers exceptional performance and durability. Trust in the value and benefits of Infineon's technology to take your designs to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have higher efficiency and faster switching speeds compared to P-CHANNEL IGBTs, making them a good choice for high power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor simplify the design and implementation of the IGBT circuit, reducing external components and potential points of failure.

Maximum Collector Current (IC): 140 A

With a high maximum collector current rating, this IGBT can handle large amounts of power, making it suitable for high power applications.

Nominal Turn Off Time (toff): 610 ns

The fast turn-off time reduces switching losses and improves efficiency in high frequency applications.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum voltage rating, this IGBT can be used in applications with higher voltage requirements, providing versatility and reliability.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable operation in harsh environments or high temperature conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS100R12KE3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

340 ns

Trade Compliance

FS100R12KE3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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