Loading...

FS100R12KT3BOSA1

Infineon Technologies

FS100R12KT3BOSA1 by Infineon Technologies

FS100R12KT3BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 6 elements in a bridge configuration. It has a max collector-emitter voltage of 1200V, nominal turn off time of 610ns, and can handle a max collector current of 140A. This IGBT is commonly used in applications requiring high power switching such as motor drives and inverters due to its fast turn on/off times and high current capacity.

Median Price

$99.140

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 10 parts In-Stock

1+ parts

$85.820

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$85.820

-

-

-

Chip1Stop

Japan . 5 parts In-Stock

1+ parts

$98.900

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$98.900

-

-

-

DigiKey

USA . 2 parts In-Stock

1+ parts

$99.140

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$99.140

-

-

-

Verical

USA . 5 parts In-Stock

1+ parts

$104.000

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$104.000

-

-

-

Element14

Singapore . 11 parts In-Stock

1+ parts

$145.990

100+ parts

$123.260

1k+ parts

-

10k+ parts

-

11

$145.990

$123.260

-

-

Arrow

USA . 80 parts In-Stock

1+ parts

$157.813

100+ parts

$147.567

1k+ parts

-

10k+ parts

-

80

$157.813

$147.567

-

-

Rochester

USA . 17 parts In-Stock

1+ parts

-

100+ parts

$81.830

1k+ parts

$73.220

10k+ parts

$68.910

17

-

$81.830

$73.220

$68.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 452 parts In-Stock

1+ parts

$73.150

100+ parts

-

1k+ parts

-

10k+ parts

-

452

$73.150

-

-

-

Vyrian

USA . 7,544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,544

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 22,712 parts In-Stock

1+ parts

$0.445

100+ parts

$0.427

1k+ parts

$0.409

10k+ parts

-

22,712

$0.445

$0.427

$0.409

-

Corohmni

South Africa . 647 parts In-Stock

1+ parts

$1.739

100+ parts

-

1k+ parts

-

10k+ parts

-

647

$1.739

-

-

-

Corphita

USA . 711 parts In-Stock

1+ parts

$69.300

100+ parts

-

1k+ parts

-

10k+ parts

-

711

$69.300

-

-

-

Ampacity Inc.

Singapore . 27 parts In-Stock

1+ parts

$74.970

100+ parts

-

1k+ parts

-

10k+ parts

-

27

$74.970

-

-

-

Continental Prestige Electronics

USA . 19 parts In-Stock

1+ parts

$190.560

100+ parts

-

1k+ parts

-

10k+ parts

-

19

$190.560

-

-

-

Microchip USA

USA . 5,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,270

-

-

-

-

Argo Parts USA

USA . 5,093 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,093

-

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Enhance your electronic systems with the FS100R12KT3BOSA1 from Infineon Technologies, a leading manufacturer known for top-notch quality and reliability. As an Insulated Gate Bipolar Transistor (IGBT), this product offers incredible performance and efficiency in various applications. With its N-CHANNEL polarity and bridge configuration, this IGBT provides seamless operation with built-in diode and thermistor for added convenience. Experience the value and benefits of this product's fast on/off times and high current capability, making it a perfect choice for your power electronics needs. Elevate your projects with the FS100R12KT3BOSA1 and unlock a world of possibilities in the realm of technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses and higher efficiency compared to P-CHANNEL IGBTs, making this product a good choice for high power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The bridge configuration with built-in diode and thermistor provides convenience and additional functionality, making this product suitable for motor control and other power conversion applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and efficient use of space in electronic assemblies.

Nominal Turn Off Time (toff): 610 ns

The relatively fast turn-off time of 610 ns ensures efficient switching and reduces power losses in the IGBT, making it suitable for high frequency applications.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage of 1200 V allows for operation in high voltage circuits, making this product ideal for power systems with higher voltage requirements.

Maximum Collector Current (IC): 140 A

With a maximum collector current of 140 A, this IGBT can handle high power levels, making it suitable for applications where a large amount of current is required.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS100R12KT3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

340 ns

Trade Compliance

FS100R12KT3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20