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IRGS14C40LPBF

Infineon Technologies

IRGS14C40LPBF by Infineon Technologies

IRGS14C40LPBF by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 370V and a max collector current of 20A. It is designed for automotive ignition applications, featuring a built-in diode and resistor in a surface-mount package style. The transistor has a max power dissipation of 125W and can operate at temperatures up to 175°C.

Median Price

$2.896

Lifecycle Status

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9

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Nova Conductors

Japan . 37 parts In-Stock

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$2.401

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Voyager Components

USA . 341 parts In-Stock

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$3.391

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$3.391

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$3.391

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$3.391

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Vyrian

USA . 1,215 parts In-Stock

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Digiode

USA . 691 parts In-Stock

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Rebound Electronics

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Ashlea Components Ltd

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Pegasus Components GmbH

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

France . 1 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,480 parts In-Stock

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$0.600

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$0.600

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Modulus Dynamics

Lithuania . 2,740 parts In-Stock

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$0.979

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$0.940

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$0.901

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2,740

$0.979

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Corohmni

South Africa . 312 parts In-Stock

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$1.134

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$1.376

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$1.252

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$1.128

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Continental Prestige Electronics

USA . 3,451 parts In-Stock

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$2.401

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$2.352

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Argo Parts USA

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AZTECH Wire

Italy . 885 parts In-Stock

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Semicontronic

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$27.050

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$26.374

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$26.238

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Ampacity Inc.

Singapore . 763 parts In-Stock

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$37.050

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 7,124 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,749 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

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Microchip USA

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GreenTree Electronics

Israel . 280 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 41 parts In-Stock

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Assy Fe

Spain . 35 parts In-Stock

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Overview

Looking for a reliable and efficient solution for automotive ignition applications? Look no further than the IRGS14C40LPBF by Infineon Technologies. With a reputation for high-quality products, Infineon Technologies delivers superior performance with this Insulated Gate Bipolar Transistor. The single configuration with built-in diode and resistor offers convenience and ease of use. Trust in Infineon Technologies to provide you with a dependable solution that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making it suitable for automotive applications.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching capabilities and low on-state resistance for improved performance.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Simplifies circuit design and reduces component count, saving space and cost.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition systems, ensuring reliable operation in harsh environments.

Maximum Rise Time (tr): 4000 ns

Provides fast switching speeds for precise control and performance in automotive ignition applications.

Maximum Power Dissipation (Abs): 125 W

Can handle high power levels, making it suitable for demanding automotive applications.

Maximum Collector-Emitter Voltage: 370 V

Allows for high voltage operation, ideal for automotive ignition systems.

Maximum Gate-Emitter Voltage: 12 V

Ensures safe operation and control of the transistor in the automotive ignition circuit.

Maximum Collector Current (IC): 20 A

Supports high current flow, essential for automotive ignition applications.

Nominal Turn On Time (ton): 3700 ns

Provides quick turn-on time for efficient performance in automotive ignition systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGS14C40LPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW SATURATION VOLTAGE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

370 V

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

12 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

4000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn On Time (ton):

3700 ns

Trade Compliance

IRGS14C40LPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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