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IRGS4615DPBF

Infineon Technologies

IRGS4615DPBF by Infineon Technologies

Infineon's IRGS4615DPBF is an N-CHANNEL IGBT with 600V VCE, 23A IC, and 99W power dissipation. Ideal for surface mount applications, it operates up to 175°C making it suitable for high-power industrial systems.

Median Price

$1.490

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 517 parts In-Stock

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-

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$1.490

1k+ parts

$1.240

10k+ parts

$1.100

517

-

$1.490

$1.240

$1.100

DigiKey

USA . 350 parts In-Stock

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-

100+ parts

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$1.270

10k+ parts

$1.270

350

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-

$1.270

$1.270

Verical

USA . 289 parts In-Stock

1+ parts

-

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-

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$1.550

10k+ parts

$1.375

289

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-

$1.550

$1.375

Distributors (In-Stock)

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Digiode

USA . 504 parts In-Stock

1+ parts

$1.159

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504

$1.159

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DigiKey Marketplace

USA . 711 parts In-Stock

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711

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Vyrian

USA . 163 parts In-Stock

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163

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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150

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Bristol Electronics

USA . 100 parts In-Stock

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100+ parts

$1.125

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100

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$1.125

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,205 parts In-Stock

1+ parts

$0.715

100+ parts

-

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2,205

$0.715

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Ampacity Inc.

Singapore . 430 parts In-Stock

1+ parts

$1.040

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430

$1.040

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Corphita

USA . 449 parts In-Stock

1+ parts

$1.098

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449

$1.098

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Corohmni

South Africa . 68 parts In-Stock

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$1.163

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68

$1.163

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Modulus Dynamics

Lithuania . 11,645 parts In-Stock

1+ parts

$1.747

100+ parts

$1.677

1k+ parts

$1.607

10k+ parts

-

11,645

$1.747

$1.677

$1.607

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Microchip USA

USA . 157 parts In-Stock

1+ parts

$7.605

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157

$7.605

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Perfect Parts

USA . 28,176 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Argo Parts USA

USA . 468 parts In-Stock

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468

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Continental Prestige Electronics

USA . 237 parts In-Stock

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237

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Overview

Elevate your electronics with the IRGS4615DPBF by Infineon Technologies, a top-of-the-line N-CHANNEL Insulated Gate Bipolar Transistor (IGBT) that promises superior performance and reliability. Infineon Technologies is known for delivering high-quality components, and this IGBT is no exception. With a maximum power dissipation of 99W and a maximum collector-emitter voltage of 600V, this device is perfect for a wide range of applications. Whether you're working on industrial machinery or automotive systems, the IRGS4615DPBF offers unmatched value and benefits, making it the ideal choice for your next project. Elevate your designs with Infineon Technologies today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high input impedance and fast switching speeds, making them ideal for use in high-frequency applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB layout, saving space and reducing assembly costs.

Maximum Power Dissipation (Abs): 99 W

With a high maximum power dissipation, this IGBT can handle large amounts of power without overheating, ensuring reliable performance under heavy loads.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable operation in a wide range of environmental conditions, making this IGBT suitable for industrial applications.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage rating makes this IGBT suitable for high voltage applications, providing a robust and reliable power switching solution.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating ensures safe operation and helps protect the IGBT from damage due to overvoltage conditions.

Maximum Collector Current (IC): 23 A

With a high maximum collector current rating, this IGBT is capable of handling large currents, making it suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The low gate-emitter threshold voltage ensures efficient and fast switching, allowing for precise control and minimizing power losses.

Terminal Finish: MATTE TIN OVER NICKEL

The matte tin over nickel terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGS4615DPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Trade Compliance

IRGS4615DPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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