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HGTP10N120BN

Onsemi

HGTP10N120BN by Onsemi

The Onsemi HGTP10N120BN is an N-CHANNEL IGBT transistor with a max VCEsat of 4.2V and a max collector-emitter voltage of 1200V. Ideal for MOTOR CONTROL applications, it has a rise time of 15ns and can handle up to 35A collector current.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,200 parts In-Stock

1+ parts

$2.320

100+ parts

$2.180

1k+ parts

$1.970

10k+ parts

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7,200

$2.320

$2.180

$1.970

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Distributors (In-Stock)

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Nova Conductors

Japan . 870 parts In-Stock

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$1.590

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870

$1.590

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Digiode

USA . 3,091 parts In-Stock

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$2.204

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3,091

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Vyrian

USA . 7,123 parts In-Stock

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Chip Stock

USA . 6,500 parts In-Stock

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Flip Electronics

USA . 800 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 35 parts In-Stock

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Holdelec - ElecDif-Pro

France . 35 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,006 parts In-Stock

1+ parts

$1.130

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3,006

$1.130

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Corohmni

South Africa . 434 parts In-Stock

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$1.558

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434

$1.558

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Continental Prestige Electronics

USA . 4,989 parts In-Stock

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$1.590

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$1.558

4,989

$1.590

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$1.558

Argo Parts USA

USA . 1,520 parts In-Stock

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$1.590

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1,520

$1.590

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Netroflash

USA . 500 parts In-Stock

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$1.590

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$1.511

10k+ parts

$1.479

500

$1.590

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$1.511

$1.479

Semicontronic

India . 7,054 parts In-Stock

1+ parts

$1.970

100+ parts

$1.921

1k+ parts

$1.911

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7,054

$1.970

$1.921

$1.911

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Ampacity Inc.

Singapore . 6,729 parts In-Stock

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$1.970

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Corphita

USA . 1,774 parts In-Stock

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$2.088

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Perfect Parts

USA . 165,312 parts In-Stock

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RC Electronics

USA . 36,327 parts In-Stock

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Lixinc

USA . 19,214 parts In-Stock

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Kulean Microsystems

USA . 8,223 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,833 parts In-Stock

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TANS Electronics

Latvia . 4,893 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,555 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Problanco Electronics

Mexico . 3,396 parts In-Stock

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Kepictronics

USA . 2,400 parts In-Stock

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SupplyDigital Components

Austria . 2,347 parts In-Stock

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Supply Digital

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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UHIMA Technologies

Türkiye . 801 parts In-Stock

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Overview

Unleash the power of precision and efficiency with the HGTP10N120BN by Onsemi. This top-of-the-line Insulated Gate Bipolar Transistor (IGBT) is designed for motor control applications, offering unparalleled performance and reliability. With a maximum collector-emitter voltage of 1200V and a maximum power dissipation of 298W, this N-channel transistor provides unmatched value and benefits to customers seeking high-quality components. Trust in Onsemi's reputation for excellence and choose the HGTP10N120BN for all your motor control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal and electrical insulation, ensuring reliable performance and protection against environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency, making them suitable for high-power applications like motor control.

Configuration: SINGLE

Single configuration simplifies circuit design and improves reliability by minimizing component count and points of failure.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and efficiency in controlling motors.

Maximum Rise Time (tr): 15 ns

Fast rise time ensures quick response and switching speed, crucial for efficient motor control and other high-speed applications.

Maximum VCEsat: 4.2 V

Low VCEsat voltage results in lower power dissipation and improved efficiency, crucial for high-power applications like motor control.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for safe operation in high voltage applications, making it suitable for a wide range of motor control systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTP10N120BN attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Fall Time (tf):

200 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

15 ns

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

450 ns

Nominal Turn Off Time (toff):

330 ns

Maximum Turn On Time (ton):

40 ns

Nominal Turn On Time (ton):

32 ns

Maximum VCEsat:

4.2 V

Trade Compliance

HGTP10N120BN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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