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HGTP12N60A4D

Onsemi

HGTP12N60A4D by Onsemi

The Onsemi HGTP12N60A4D is an N-CHANNEL IGBT with VCEsat of 2.7V, IC of 54A, and Pmax of 167W. Ideal for POWER CONTROL applications due to its fast tf of 95ns and toff of 180ns. Operates in temperatures from -55°C to 150°C with a VCE max of 600V.

Median Price

$1.792

Lifecycle Status

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14

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1k+

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Adafruit Industries

USA . 550 parts In-Stock

1+ parts

$1.834

100+ parts

$1.669

1k+ parts

$1.504

10k+ parts

-

550

$1.834

$1.669

$1.504

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Rochester

USA . 76,266 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

$1.400

10k+ parts

$1.320

76,266

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$1.570

$1.400

$1.320

DigiKey

USA . 76,266 parts In-Stock

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$2.060

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$2.060

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Verical

USA . 64,636 parts In-Stock

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$1.750

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$1.650

64,636

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$1.650

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Vyrian

USA . 746 parts In-Stock

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$1.590

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746

$1.590

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Digiode

USA . 1,879 parts In-Stock

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$1.662

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DigiKey Marketplace

USA . 79,266 parts In-Stock

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Chip Stock

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Euro-Tech

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PC Components Company LLC

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Bristol Electronics

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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ABC Electronics Ltd.

UK . 6 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Native Components

USA . 851 parts In-Stock

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$0.804

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851

$0.804

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Northwest PG Solutions

USA . 1,441 parts In-Stock

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$0.885

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$0.885

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Corphita

USA . 1,391 parts In-Stock

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$1.575

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Corohmni

South Africa . 371 parts In-Stock

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$1.750

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Component Stockers USA

USA . 101,246 parts In-Stock

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$1.780

100+ parts

$1.680

1k+ parts

$1.510

10k+ parts

$1.510

101,246

$1.780

$1.680

$1.510

$1.510

Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$1.834

100+ parts

$1.669

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$1.504

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550

$1.834

$1.669

$1.504

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Microchip USA

USA . 6,894 parts In-Stock

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$10.920

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Metaverse IC Inc.

Canada . 75,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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SupplyDigital Components

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Authorized Procurement Solutions

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Problanco Electronics

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A-Z Elektronik GmbH

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Kulean Microsystems

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Supply Digital

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Alle Elektronik GmbH

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Perfect Parts

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Glotronic Ltd.

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TANS Electronics

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UHIMA Technologies

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Overview

Looking for a reliable power control solution? Look no further than the HGTP12N60A4D by Onsemi. As a trusted manufacturer in the industry of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers top-quality products like the HGTP12N60A4D with a single configuration and built-in diode. Ideal for applications requiring high power dissipation, this transistor offers a maximum collector-emitter voltage of 600V and a maximum collector current of 54A. With fast turn-on/off times and a wide operating temperature range, this transistor provides exceptional value and performance for your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making it more convenient to use in power control applications.

Maximum VCEsat: 2.7 V

Low VCEsat helps in reducing power dissipation and improving efficiency in power control applications.

Maximum Power Dissipation (Abs): 167 W

With high power dissipation capability, this IGBT can handle heavy loads and high power applications effectively.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltage levels, making it suitable for power control applications where high voltage is involved.

Maximum Gate-Emitter Voltage: 20 V

Allows for precise control over the switching characteristics of the IGBT for efficient power control.

Maximum Collector Current (IC): 54 A

Capable of handling high current levels, making it suitable for power control applications that require high current carrying capacity.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTP12N60A4D attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

95 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

265 ns

Nominal Turn Off Time (toff):

180 ns

Nominal Turn On Time (ton):

33 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGTP12N60A4D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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