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HGTP11N120CN

Onsemi

HGTP11N120CN by Onsemi

The Onsemi HGTP11N120CN is an N-CHANNEL IGBT transistor with a max VCEsat of 2.4V and a max IC of 43A. Ideal for MOTOR CONTROL applications, it has a package style of FLANGE MOUNT and can operate in temperatures ranging from -55 to 150 °C.

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,152 parts In-Stock

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Digiode

USA . 1,611 parts In-Stock

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Pegasus Components GmbH

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kulean Microsystems

USA . 8,245 parts In-Stock

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A-Z Elektronik GmbH

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Supply Digital

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Alle Elektronik GmbH

Germany . 3,564 parts In-Stock

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TANS Electronics

Latvia . 2,833 parts In-Stock

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SupplyDigital Components

Austria . 2,757 parts In-Stock

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Corphita

USA . 1,133 parts In-Stock

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Native Components

USA . 856 parts In-Stock

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UHIMA Technologies

Türkiye . 663 parts In-Stock

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Problanco Electronics

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Northwest PG Solutions

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Corohmni

South Africa . 391 parts In-Stock

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Overview

Experience unparalleled performance with the Onsemi HGTP11N120CN Insulated Gate Bipolar Transistor. Manufactured by Onsemi, this N-CHANNEL transistor is ideal for MOTOR CONTROL applications. Offering a maximum VCEsat of 2.4V and a maximum Collector-Emitter Voltage of 1200V, this transistor delivers exceptional power dissipation and efficiency. Trust in Onsemi's reputation for quality and reliability, and maximize your motor control systems with the HGTP11N120CN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs generally have lower on-state resistance, improving efficiency and reducing power dissipation.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and reliability in such scenarios.

Maximum Rise Time (tr): 16 ns

Fast rise time allows for quick switching, reducing power losses and improving efficiency.

Maximum VCEsat: 2.4 V

Low VCEsat rating helps in minimizing power dissipation and improving overall efficiency.

Maximum Power Dissipation (Abs): 298 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating makes this IGBT suitable for applications that require handling of high voltages.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows for use in various environmental conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTP11N120CN attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Fall Time (tf):

400 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

16 ns

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

680 ns

Nominal Turn Off Time (toff):

550 ns

Maximum Turn On Time (ton):

42 ns

Nominal Turn On Time (ton):

33 ns

Maximum VCEsat:

2.4 V

Trade Compliance

HGTP11N120CN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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