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HGTP7N60A4D

Onsemi

HGTP7N60A4D by Onsemi

HGTP7N60A4D by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.7V and IC of 34A, ideal for POWER CONTROL applications. It has a package style of FLANGE MOUNT, can handle up to 600V, and operates b/w -55 to 150 °C, offering fast switching times with tf at 85ns and toff at 205ns.

Median Price

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2

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1k+

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Vyrian

USA . 1,283 parts In-Stock

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Digiode

USA . 857 parts In-Stock

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Ampacity Inc.

Singapore . 1,544 parts In-Stock

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$42.050

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Component Stockers USA

USA . 257 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,011 parts In-Stock

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SupplyDigital Components

Austria . 7,411 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,107 parts In-Stock

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TANS Electronics

Latvia . 6,331 parts In-Stock

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Alle Elektronik GmbH

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Problanco Electronics

Mexico . 4,707 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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Glotronic Ltd.

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Corphita

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Northwest PG Solutions

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Native Components

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UHIMA Technologies

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Corohmni

South Africa . 469 parts In-Stock

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Overview

Unlock the power of the HGTP7N60A4D by Onsemi, a high-quality Insulated Gate Bipolar Transistor designed for power control applications. With its N-channel configuration and built-in diode, this transistor offers unmatched efficiency and reliability. Manufactured by Onsemi, known for their cutting-edge technology and rigorous quality standards, this product is a game-changer in the industry. Experience faster turn-on times, lower VCEsat, and superior performance with the HGTP7N60A4D. Elevate your projects to new heights with this advanced transistor that delivers exceptional value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IGBT.

Polarity or Channel Type: N-CHANNEL

Offers efficient power control capabilities for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and reduces the need for additional components.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance.

Maximum VCEsat: 2.7 V

Low saturation voltage helps reduce power dissipation and improve efficiency.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit layouts.

Terminal Form: THROUGH-HOLE

Simplifies installation and connection processes.

Maximum Fall Time (tf): 85 ns

Fast fall time allows for quick switching operations.

Nominal Turn Off Time (toff): 205 ns

Ensures efficient turn-off performance for effective power control.

No. of Terminals: 3

Provides necessary connections for power control applications.

Maximum Power Dissipation (Abs): 125 W

Supports high-power applications with reliable thermal performance.

Package Style (Meter): FLANGE MOUNT

Offers secure mounting options for stable installation.

Maximum Operating Temperature: 150 °C

Can operate efficiently in high-temperature environments.

Maximum Collector-Emitter Voltage: 600 V

Suitable for applications requiring high voltage handling capabilities.

Transistor Element Material: SILICON

Provides reliable performance and durability for long-term use.

Maximum Gate-Emitter Voltage: 20 V

Allows for precise control of the gate signal to the IGBT.

Minimum Operating Temperature: -55 °C

Can withstand low-temperature environments for versatile use.

Maximum Collector Current (IC): 34 A

Supports high current loads for power control applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

Ensures efficient gate control for stable operation.

Maximum Turn Off Time (toff): 235 ns

Provides additional information about turn-off performance for precise power control.

Terminal Position: SINGLE

Simplifies connection and installation processes.

Case Connection: COLLECTOR

Provides specific connection reference for the IGBT.

Nominal Turn On Time (ton): 17 ns

Fast turn-on time for quick power control responses.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTP7N60A4D attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

85 ns

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

235 ns

Nominal Turn Off Time (toff):

205 ns

Nominal Turn On Time (ton):

17 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGTP7N60A4D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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