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HGTP1N120BN

Onsemi

HGTP1N120BN by Onsemi

The Onsemi HGTP1N120BN is an N-CHANNEL IGBT transistor with 1200V VCEsat and 5.3A IC, ideal for MOTOR CONTROL applications. It features a tr of 15ns, tf of 370ns, and toff of 333ns, making it efficient in power dissipation up to 60W. This SINGLE configuration device operates b/w -55 °C to 150°C temperature range.

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1k+

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Digiode

USA . 2,244 parts In-Stock

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TANS Electronics

Latvia . 6,550 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,226 parts In-Stock

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Supply Digital

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Alle Elektronik GmbH

Germany . 3,484 parts In-Stock

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Problanco Electronics

Mexico . 2,773 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 1,975 parts In-Stock

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Northwest PG Solutions

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SupplyDigital Components

Austria . 699 parts In-Stock

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Native Components

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Corohmni

South Africa . 138 parts In-Stock

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UHIMA Technologies

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Overview

Enhance your motor control applications with the HGTP1N120BN from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors that provide unparalleled performance and reliability. This N-channel transistor offers customers value through its fast rise and fall times, low VCEsat, and high power dissipation capabilities. Say goodbye to inefficiencies and hello to optimal performance with the HGTP1N120BN by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and protection for the IGBT, ensuring durability and reliability in various operating conditions.

Maximum VCEsat: 2.9 V

Low VCEsat value indicates efficient switching performance and lower power dissipation, making this IGBT suitable for motor control applications where efficiency is crucial.

Maximum Power Dissipation (Abs): 60 W

With a high power dissipation of 60W, this IGBT can handle high power levels, making it ideal for motor control applications that require high power output.

Maximum Operating Temperature: 150 °C

The IGBT can operate at temperatures up to 150 °C, allowing it to function in high-temperature environments without performance degradation.

Maximum Collector-Emitter Voltage: 1200 V

The high voltage rating of 1200V ensures the IGBT can handle high voltage levels, making it suitable for motor control applications with high voltage requirements.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTP1N120BN attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Fall Time (tf):

370 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

15 ns

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

458 ns

Nominal Turn Off Time (toff):

333 ns

Maximum Turn On Time (ton):

32 ns

Nominal Turn On Time (ton):

24 ns

Maximum VCEsat:

2.9 V

Trade Compliance

HGTP1N120BN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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