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IGA03N120H2XKSA1

Infineon Technologies

IGA03N120H2XKSA1 by Infineon Technologies

Infineon's IGA03N120H2XKSA1 is an N-Channel IGBT with 1200V VCE, 310ns toff, and 14.4ns ton. Ideal for high-power applications requiring fast switching such as industrial motor drives and renewable energy systems.

Median Price

$1.540

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.540

1k+ parts

$1.280

10k+ parts

$1.140

100

-

$1.540

$1.280

$1.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 827 parts In-Stock

1+ parts

$1.206

100+ parts

-

1k+ parts

-

10k+ parts

-

827

$1.206

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.590

100+ parts

-

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300

$1.590

-

-

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Vyrian

USA . 3,611 parts In-Stock

1+ parts

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3,611

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 286 parts In-Stock

1+ parts

$0.870

100+ parts

-

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286

$0.870

-

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Ampacity Inc.

Singapore . 31 parts In-Stock

1+ parts

$1.080

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-

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31

$1.080

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Corphita

USA . 827 parts In-Stock

1+ parts

$1.143

100+ parts

-

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827

$1.143

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Component Stockers USA

USA . 53 parts In-Stock

1+ parts

$1.300

100+ parts

-

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53

$1.300

-

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Aztec Data Supply Inc.

USA . 105 parts In-Stock

1+ parts

$1.430

100+ parts

-

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105

$1.430

-

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Modulus Dynamics

Lithuania . 19,798 parts In-Stock

1+ parts

$1.454

100+ parts

$1.396

1k+ parts

$1.338

10k+ parts

-

19,798

$1.454

$1.396

$1.338

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Continental Prestige Electronics

USA . 4,039 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

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10k+ parts

$1.558

4,039

$1.590

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-

$1.558

Argo Parts USA

USA . 2,072 parts In-Stock

1+ parts

$1.590

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2,072

$1.590

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Microchip USA

USA . 6,140 parts In-Stock

1+ parts

$7.930

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6,140

$7.930

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AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$11.738

100+ parts

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754

$11.738

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$1.558

1k+ parts

$1.511

10k+ parts

$1.479

2,000

-

$1.558

$1.511

$1.479

Perfect Parts

USA . 1,680 parts In-Stock

1+ parts

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100+ parts

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1,680

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Enhance your electronic projects with the high-quality IGA03N120H2XKSA1 Insulated Gate Bipolar Transistor from Infineon Technologies. With a maximum collector-emitter voltage of 1200V and a nominal turn-off time of 310ns, this N-channel transistor is designed to deliver superior performance and reliability. Ideal for a wide range of applications, this IGBT offers exceptional value and benefits to customers looking for efficient power control solutions. Trust in the expertise of Infineon Technologies to provide you with top-notch components for all your electronic needs.

Feature Benefit Bullets

Polarity or Channel Type: N-Channel

N-Channel IGBTs typically have lower conduction losses and higher efficiency compared to P-Channel IGBTs, making them a good choice for high power applications.

Nominal Turn Off Time (toff): 310 ns

The low turn-off time of 310 ns ensures fast switching speed and reduces switching losses, making the IGBT suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this IGBT can withstand elevated temperatures and operate reliably in demanding thermal environments.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage of 1200 V allows for handling high voltage levels, making this IGBT suitable for power electronics and industrial applications.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high performance, reliability, and efficiency, making them a preferred choice for various power switching applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20 V ensures reliable and stable gate control, contributing to the overall efficiency and performance of the IGBT.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 °C allows the IGBT to be used in extreme cold environments, making it versatile and suitable for a variety of applications.

Maximum Gate-Emitter Threshold Voltage: 3.9 V

The low gate-emitter threshold voltage of 3.9 V enables efficient and precise control of the IGBT, contributing to its overall performance and reliability.

Terminal Finish: TIN

The TIN terminal finish provides a reliable and durable connection, ensuring long-term stability and performance of the IGBT in various operating conditions.

Nominal Turn On Time (ton): 14.4 ns

The fast turn-on time of 14.4 ns results in quick switching and reduced on-state losses, enhancing the efficiency and performance of the IGBT in power electronics applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IGA03N120H2XKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

3.9 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Polarity or Channel Type:

Terminal Finish:

TIN

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

310 ns

Nominal Turn On Time (ton):

14.4 ns

Trade Compliance

IGA03N120H2XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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