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FF650R17IE4DB2BOSA1

Infineon Technologies

FF650R17IE4DB2BOSA1 by Infineon Technologies

Infineon Technologies' FF650R17IE4DB2BOSA1 is a N-CHANNEL IGBT with 2 elements, diode, and thermistor. It offers VCEsat of 2.45V, IC of 930A, and Pmax of 4150W. Ideal for power control applications due to its high voltage rating (1700V) and fast switching times (ton:765ns, toff:1870ns).

Median Price

$476.224

Lifecycle Status

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6

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1k+

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Rochester

USA . 444 parts In-Stock

1+ parts

$423.310

100+ parts

$397.910

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$372.510

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444

$423.310

$397.910

$372.510

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Verical

USA . 441 parts In-Stock

1+ parts

$529.138

100+ parts

$497.387

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$465.637

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441

$529.138

$497.387

$465.637

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Digiode

USA . 628 parts In-Stock

1+ parts

$486.115

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628

$486.115

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Nova Conductors

Japan . 100 parts In-Stock

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$762.970

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100

$762.970

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Vyrian

USA . 2,032 parts In-Stock

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TME

Poland . 2 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,302 parts In-Stock

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$1.020

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$1.020

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Modulus Dynamics

Lithuania . 4,115 parts In-Stock

1+ parts

$1.659

100+ parts

$1.593

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$1.526

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4,115

$1.659

$1.593

$1.526

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Corohmni

South Africa . 105 parts In-Stock

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$1.868

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$1.868

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AZTECH Wire

Italy . 261 parts In-Stock

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$5.558

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Corphita

USA . 240 parts In-Stock

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$460.530

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$460.530

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Argo Parts USA

USA . 4,655 parts In-Stock

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$762.970

100+ parts

$755.340

1k+ parts

$747.711

10k+ parts

$740.081

4,655

$762.970

$755.340

$747.711

$740.081

Continental Prestige Electronics

USA . 4,492 parts In-Stock

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$762.970

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$747.711

4,492

$762.970

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$747.711

Netroflash

USA . 100 parts In-Stock

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$762.970

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$747.711

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100

$762.970

$747.711

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Ampacity Inc.

Singapore . 242 parts In-Stock

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$946.640

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$946.640

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Semicontronic

India . 242 parts In-Stock

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$946.640

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$922.974

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$918.241

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242

$946.640

$922.974

$918.241

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Eastek

USA . 36 parts In-Stock

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Overview

Discover the FF650R17IE4DB2BOSA1 by Infineon Technologies, a high-quality Insulated Gate Bipolar Transistor designed for power control applications. With 2 elements, built-in diode, and thermistor, this N-CHANNEL transistor offers unmatched performance and reliability. Experience seamless power management with a maximum collector-emitter voltage of 1700V and a maximum operating temperature of 150°C. From series connected configuration to fast turn-off time, this transistor is engineered to meet your specific needs. Trust in Infineon Technologies to deliver cutting-edge technology that drives innovation and efficiency in your projects. Unlock the potential of your applications with the FF650R17IE4DB2BOSA1 today.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - This N-channel configuration allows for efficient switching and control of power in a variety of applications.

Configuration:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR - This configuration provides enhanced protection and stability in power control applications.

Transistor Application:

POWER CONTROL - Specifically designed for power control applications, ensuring reliable and efficient performance.

Maximum VCEsat:

2.45 V - Low VCEsat helps minimize power loss and improves overall efficiency.

Package Shape:

RECTANGULAR - Rectangular package shape allows for easy mounting and efficient use of space on circuit boards.

No. of Elements:

2 - Dual elements provide redundancy and increased performance capabilities.

Nominal Turn Off Time (toff):

1870 ns - Fast turn off time ensures quick response and precise control in power switching applications.

No. of Terminals:

10 - Having 10 terminals allows for versatile connection options and flexibility in circuit design.

Maximum Power Dissipation (Abs):

4150 W - High power dissipation capability makes this transistor suitable for high-power applications.

Package Style (Meter):

FLANGE MOUNT - Flange mount package style provides secure mounting and thermal management in industrial applications.

Maximum Operating Temperature:

150 °C - High maximum operating temperature ensures reliability in harsh environmental conditions.

Maximum Collector-Emitter Voltage:

1700 V - High VCE voltage rating allows for use in high-voltage applications.

Transistor Element Material:

SILICON - Silicon material offers high reliability and performance in power control applications.

Maximum Gate-Emitter Voltage:

20 V - High gate-emitter voltage rating provides robustness and stability in power control circuits.

Minimum Operating Temperature:

40 °C - Low minimum operating temperature ensures usability in a wide range of environments.

Maximum Collector Current (IC):

930 A - High collector current rating makes this transistor suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage:

6.4 V - Gate-emitter threshold voltage ensures precise control and efficient switching in power circuits.

Terminal Position:

UPPER - Upper terminal position allows for easy connection and maintenance in circuit design.

Case Connection:

ISOLATED - Isolated case connection enhances safety and protection in power control applications.

Nominal Turn On Time (ton):

765 ns - Fast turn on time provides quick response and precise control in power switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF650R17IE4DB2BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X10

No. of Elements:

2

No. of Terminals:

10

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1870 ns

Nominal Turn On Time (ton):

765 ns

Maximum VCEsat:

2.45 V

Trade Compliance

FF650R17IE4DB2BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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