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FF650R17IE4BOSA1

Infineon Technologies

FF650R17IE4BOSA1 by Infineon Technologies

Infineon Technologies' FF650R17IE4BOSA1 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and thermistor. Ideal for POWER CONTROL applications, it has a max voltage of 1700V, max current of 930A, and operates up to 175°C. With turn on time of 720ns and turn off time of 1870ns, this rectangular package transistor is flange mountable with isolated case connection.

Median Price

$355.620

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3 parts In-Stock

1+ parts

$308.490

100+ parts

-

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-

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3

$308.490

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Rochester

USA . 2 parts In-Stock

1+ parts

$340.300

100+ parts

$319.880

1k+ parts

$299.460

10k+ parts

-

2

$340.300

$319.880

$299.460

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DigiKey

USA . 24 parts In-Stock

1+ parts

$355.620

100+ parts

-

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24

$355.620

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Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$420.000

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3

$420.000

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Verical

USA . 2 parts In-Stock

1+ parts

$425.375

100+ parts

$399.850

1k+ parts

$374.325

10k+ parts

-

2

$425.375

$399.850

$374.325

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EBV Elektronik

Germany . 3 parts In-Stock

1+ parts

-

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3

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Distributors (In-Stock)

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Digiode

USA . 399 parts In-Stock

1+ parts

$313.500

100+ parts

-

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399

$313.500

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$594.905

100+ parts

-

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300

$594.905

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NAC Semi

USA . 3 parts In-Stock

1+ parts

$1,080.060

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3

$1,080.060

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Vyrian

USA . 3,396 parts In-Stock

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3,396

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TME

Poland . 3 parts In-Stock

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3

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Distributors (Availability)

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Corohmni

South Africa . 279 parts In-Stock

1+ parts

$0.692

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-

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279

$0.692

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Aztec Data Supply Inc.

USA . 103 parts In-Stock

1+ parts

$0.720

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103

$0.720

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Modulus Dynamics

Lithuania . 10,054 parts In-Stock

1+ parts

$0.936

100+ parts

$0.899

1k+ parts

$0.861

10k+ parts

-

10,054

$0.936

$0.899

$0.861

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$12.811

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460

$12.811

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Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$283.900

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3

$283.900

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Corphita

USA . 933 parts In-Stock

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$297.000

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933

$297.000

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Component Stockers USA

USA . 10 parts In-Stock

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$490.050

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10

$490.050

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$583.007

100+ parts

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1k+ parts

$559.686

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50

$583.007

-

$559.686

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Continental Prestige Electronics

USA . 3,798 parts In-Stock

1+ parts

$594.905

100+ parts

-

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$583.007

3,798

$594.905

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-

$583.007

Argo Parts USA

USA . 1,098 parts In-Stock

1+ parts

$594.905

100+ parts

$588.956

1k+ parts

$583.007

10k+ parts

$577.058

1,098

$594.905

$588.956

$583.007

$577.058

Eastek

USA . 12 parts In-Stock

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12

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Overview

Unleash the power of the FF650R17IE4BOSA1 by Infineon Technologies, a top-tier Insulated Gate Bipolar Transistor (IGBT) that sets new standards in performance and reliability. Manufactured by industry leader Infineon Technologies, this N-CHANNEL transistor boasts a series connected, center tap configuration with built-in diode and thermistor, making it ideal for power control applications. With its superior design and engineering, this product offers customers unparalleled value, benefits, and advantages, ensuring efficient and dependable operation in a variety of high-power settings. Experience the difference with the FF650R17IE4BOSA1 from Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - Helps in efficient power control applications requiring high voltage.

Configuration:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR - Provides enhanced reliability and performance in complex power systems.

Transistor Application:

POWER CONTROL - Ideal for applications requiring precise control over power output.

Package Shape:

RECTANGULAR - Offers easy integration into existing circuit designs.

No. of Elements:

2 - Provides redundancy and reliability in critical power systems.

Nominal Turn Off Time (toff):

1870 ns - Ensures fast switching speed for improved efficiency.

No. of Terminals:

7 - Provides flexibility in connecting external components.

Package Style (Meter):

FLANGE MOUNT - Enables secure mounting and heat dissipation.

Maximum Operating Temperature:

175 °C - Allows operation in high-temperature environments.

Maximum Collector-Emitter Voltage:

1700 V - Suitable for high voltage applications.

Transistor Element Material:

SILICON - Offers high reliability and performance characteristics.

Maximum Collector Current (IC):

930 A - Capable of handling high current loads with ease.

Terminal Position:

UPPER - Simplifies connection and installation process.

Case Connection:

ISOLATED - Ensures safety and protection against electrical hazards.

Nominal Turn On Time (ton):

720 ns - Enables precise control and fast response times.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF650R17IE4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1870 ns

Nominal Turn On Time (ton):

720 ns

Trade Compliance

FF650R17IE4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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