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FF650R17IE4PBOSA1

Infineon Technologies

FF650R17IE4PBOSA1 by Infineon Technologies

FF650R17IE4PBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and thermistor. It has a max VCE of 1700V and toff of 1870ns, making it ideal for power control applications. This UL APPROVED transistor operates from -40°C with a ton of 720ns in a FLANGE MOUNT package style.

Median Price

$442.670

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 105 parts In-Stock

1+ parts

$354.140

100+ parts

$332.890

1k+ parts

$311.640

10k+ parts

-

105

$354.140

$332.890

$311.640

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DigiKey

USA . 147 parts In-Stock

1+ parts

$442.670

100+ parts

-

1k+ parts

-

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147

$442.670

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-

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Verical

USA . 90 parts In-Stock

1+ parts

$442.675

100+ parts

$416.113

1k+ parts

$389.550

10k+ parts

-

90

$442.675

$416.113

$389.550

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 897 parts In-Stock

1+ parts

$469.509

100+ parts

-

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897

$469.509

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DigiKey Marketplace

USA . 90 parts In-Stock

1+ parts

$540.320

100+ parts

-

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-

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90

$540.320

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$556.025

100+ parts

-

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500

$556.025

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Vyrian

USA . 7,846 parts In-Stock

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-

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7,846

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,356 parts In-Stock

1+ parts

$0.530

100+ parts

-

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-

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4,356

$0.530

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-

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AZTECH Wire

Italy . 635 parts In-Stock

1+ parts

$16.036

100+ parts

-

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635

$16.036

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-

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Semicontronic

India . 105 parts In-Stock

1+ parts

$420.090

100+ parts

$409.588

1k+ parts

$407.487

10k+ parts

-

105

$420.090

$409.588

$407.487

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Ampacity Inc.

Singapore . 80 parts In-Stock

1+ parts

$420.090

100+ parts

-

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80

$420.090

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Corphita

USA . 222 parts In-Stock

1+ parts

$444.798

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222

$444.798

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Component Stockers USA

USA . 127 parts In-Stock

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$520.530

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127

$520.530

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Modulus Dynamics

Lithuania . 6,361 parts In-Stock

1+ parts

$545.469

100+ parts

$523.650

1k+ parts

$501.831

10k+ parts

-

6,361

$545.469

$523.650

$501.831

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Corohmni

South Africa . 262 parts In-Stock

1+ parts

$545.469

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262

$545.469

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Continental Prestige Electronics

USA . 5,916 parts In-Stock

1+ parts

$556.025

100+ parts

-

1k+ parts

-

10k+ parts

$544.905

5,916

$556.025

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-

$544.905

Argo Parts USA

USA . 1,126 parts In-Stock

1+ parts

$556.025

100+ parts

$550.465

1k+ parts

$544.905

10k+ parts

$539.344

1,126

$556.025

$550.465

$544.905

$539.344

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$556.025

100+ parts

-

1k+ parts

$528.224

10k+ parts

$517.103

1,000

$556.025

-

$528.224

$517.103

Microchip USA

USA . 4,708 parts In-Stock

1+ parts

$720.027

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-

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4,708

$720.027

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

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2,500

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Overview

Transform your power control applications with the FF650R17IE4PBOSA1 from Infineon Technologies. Built with the highest quality materials and innovative design, this insulated gate bipolar transistor offers unparalleled performance and reliability. Whether you're in the automotive, industrial, or renewable energy sector, this N-channel transistor is the perfect solution for your power control needs. Say goodbye to downtime and hello to efficiency with the FF650R17IE4PBOSA1 - the ultimate choice for professionals who demand excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good insulation and protection for the transistor, making it durable and reliable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency, making them suitable for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for more precise control and protection of the power circuit, enhancing the performance and reliability of the transistor.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring efficient and reliable operation in high-power systems.

No. of Elements: 2

Having 2 elements allows for better power distribution and control, enhancing the overall performance of the transistor.

Maximum Collector-Emitter Voltage: 1700 V

High maximum voltage rating allows the transistor to handle high voltage applications, making it versatile for various power control tasks.

Nominal Turn On Time (ton): 720 ns

Fast turn-on time ensures quick response and efficiency in power control, improving overall system performance.

Reference Standard: UL APPROVED

UL approval ensures that the product meets safety and performance standards, making it a reliable choice for industrial and commercial applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF650R17IE4PBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1700 V

JESD-30 Code:

R-PUFM-X10

No. of Elements:

2

No. of Terminals:

10

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1870 ns

Nominal Turn On Time (ton):

720 ns

Trade Compliance

FF650R17IE4PBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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