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FGH40N65UFDTU-F085

Onsemi

FGH40N65UFDTU-F085 by Onsemi

FGH40N65UFDTU-F085 by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.4V and IC of 80A, ideal for POWER CONTROL applications. It has a max VCE of 650V, operating temperature up to 150°C, and a turn-off time (toff) of 152ns. This RECTANGULAR package transistor features a built-in diode and matte tin finish for efficient performance in various power control systems.

Median Price

$2.868

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 300 parts In-Stock

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-

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-

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$3.025

10k+ parts

$2.850

300

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$3.025

$2.850

Rochester

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$2.710

1k+ parts

$2.420

10k+ parts

$2.280

300

-

$2.710

$2.420

$2.280

Distributors (In-Stock)

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Nova Conductors

Japan . 119 parts In-Stock

1+ parts

$2.311

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119

$2.311

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Digiode

USA . 3,468 parts In-Stock

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Vyrian

USA . 588 parts In-Stock

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588

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Distributors (Availability)

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Corohmni

South Africa . 439 parts In-Stock

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$2.265

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439

$2.265

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Continental Prestige Electronics

USA . 5,542 parts In-Stock

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$2.311

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$2.265

5,542

$2.311

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$2.265

Argo Parts USA

USA . 2,250 parts In-Stock

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$2.311

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2,250

$2.311

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Netroflash

USA . 1,050 parts In-Stock

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$2.311

100+ parts

$2.265

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1,050

$2.311

$2.265

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Ampacity Inc.

Singapore . 624 parts In-Stock

1+ parts

$7.050

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624

$7.050

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AZTECH Wire

Italy . 1,603 parts In-Stock

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$9.890

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$9.890

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Component Stockers USA

USA . 714 parts In-Stock

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$99.990

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 25,315 parts In-Stock

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Kulean Microsystems

USA . 10,643 parts In-Stock

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Problanco Electronics

Mexico . 9,315 parts In-Stock

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TANS Electronics

Latvia . 8,862 parts In-Stock

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SupplyDigital Components

Austria . 8,190 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 2,600 parts In-Stock

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Supply Digital

USA . 2,065 parts In-Stock

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UHIMA Technologies

Türkiye . 1,235 parts In-Stock

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Overview

Enhance your power control applications with the FGH40N65UFDTU-F085 by Onsemi. Crafted with precision and quality, this N-channel IGBT transistor offers exceptional performance and reliability. With a maximum VCEsat of 2.4V and a maximum collector-emitter voltage of 650V, this transistor ensures efficient power management. Whether you're in the automotive industry or working on industrial projects, this single configuration transistor with a built-in diode is a valuable asset. Trust Onsemi's expertise in semiconductor manufacturing and elevate your power control systems to the next level with the FGH40N65UFDTU-F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides good insulation and protection for the IGBT, ensuring its durability and reliability in various operating conditions.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this IGBT a convenient choice for power control applications.

Maximum VCEsat: 2.4 V

Low VCEsat value indicates minimal on-state voltage drop, leading to high efficiency and reduced power loss in power control applications.

Maximum Power Dissipation (Abs): 290 W

High power dissipation capability allows the IGBT to handle heavy loads and high power levels efficiently.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range ensures the IGBT can withstand elevated temperatures without compromising performance, making it suitable for various industrial applications.

Maximum Collector-Emitter Voltage: 650 V

High VCE voltage rating provides robustness and reliability for the IGBT to handle high voltage applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N65UFDTU-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Fall Time (tf):

60 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

152 ns

Nominal Turn On Time (ton):

58 ns

Maximum VCEsat:

2.4 V

Trade Compliance

FGH40N65UFDTU-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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