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IKQ75N120CH3

Infineon Technologies

IKQ75N120CH3 by Infineon Technologies

IKQ75N120CH3 by Infineon is an N-CHANNEL IGBT with VCEsat of 2.35V and IC of 150A. Ideal for POWER CONTROL applications, it has a max VCE of 1200V and can dissipate up to 938W. With fast turn-off time (454ns) and turn-on time (81ns), it operates b/w -40°C to 175°C effectively.

Median Price

$11.794

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Maritex

Poland . 49 parts In-Stock

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$11.507

100+ parts

$7.469

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49

$11.507

$7.469

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Vyrian

USA . 1,504 parts In-Stock

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Digiode

USA . 556 parts In-Stock

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Rutronik

Germany . 120 parts In-Stock

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$12.080

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$10.940

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120

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$12.080

$10.940

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Nova Conductors

Japan . 41 parts In-Stock

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Modulus Dynamics

Lithuania . 14,423 parts In-Stock

1+ parts

$1.303

100+ parts

$1.251

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$1.199

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14,423

$1.303

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Corohmni

South Africa . 37 parts In-Stock

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$1.544

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Ampacity Inc.

Singapore . 907 parts In-Stock

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$7.050

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907

$7.050

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AZTECH Wire

Italy . 628 parts In-Stock

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$8.229

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628

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Semicontronic

India . 1,621 parts In-Stock

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$43.050

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$41.974

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$41.758

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1,621

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$41.974

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A-Z Elektronik GmbH

Germany . 8,106 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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Argo Parts USA

USA . 4,035 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,804 parts In-Stock

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Continental Prestige Electronics

USA . 3,267 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Corphita

USA . 975 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Experience the power and reliability of the IKQ75N120CH3 Insulated Gate Bipolar Transistor by Infineon Technologies. Designed with a single built-in diode for efficient power control, this N-channel transistor offers a maximum collector-emitter voltage of 1200V and a maximum collector current of 150A. With a package style of flange mount and an operating temperature range from -40 to 175°C, this transistor is ideal for a wide range of applications where high power dissipation and fast switching times are crucial. Trust in Infineon's reputation for quality and innovation, and elevate your power control systems with the IKQ75N120CH3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection to the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and faster switching speeds than P-channel IGBTs, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and provides a path for freewheeling current during switching, improving efficiency.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in controlling high power loads.

Maximum VCEsat: 2.35 V

Low VCEsat helps in minimizing power losses and improving efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and assembly in various electronic systems.

Nominal Turn Off Time (toff): 454 ns

Fast turn off time enhances the switching speed of the IGBT, leading to improved performance in high frequency applications.

Maximum Power Dissipation (Abs): 938 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without performance degradation, suitable for demanding industrial environments.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating enables the IGBT to handle high voltage applications with ease, ensuring safety and reliability.

Maximum Gate-Emitter Voltage: 20 V

Provides sufficient margin for gate drive voltage, ensuring proper switching behavior and protecting the IGBT from damage.

Maximum Collector Current (IC): 150 A

High collector current rating allows the IGBT to handle large current loads, making it suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The specified gate-emitter threshold voltage ensures proper turn-on characteristics, preventing false triggering and improving stability.

Nominal Turn On Time (ton): 81 ns

Fast turn on time enables quick response in switching applications, enhancing overall performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKQ75N120CH3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

454 ns

Nominal Turn On Time (ton):

81 ns

Maximum VCEsat:

2.35 V

Trade Compliance

IKQ75N120CH3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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