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FGH40N60SMDF-F085

Onsemi

FGH40N60SMDF-F085 by Onsemi

FGH40N60SMDF-F085 by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.5V and IC of 80A. Ideal for POWER CONTROL applications, it has a toff of 123ns, tf of 20ns, and can handle up to 349W power dissipation. Operating b/w -55°C to 175°C, it features a max VCE of 600V and gate-emitter voltage of 20V.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13 parts In-Stock

1+ parts

-

100+ parts

$2.720

1k+ parts

$2.430

10k+ parts

$2.290

13

-

$2.720

$2.430

$2.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 584 parts In-Stock

1+ parts

$2.565

100+ parts

-

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584

$2.565

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Digiode

USA . 2,816 parts In-Stock

1+ parts

$2.888

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2,816

$2.888

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Vyrian

USA . 2,421 parts In-Stock

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2,421

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 213 parts In-Stock

1+ parts

$1.827

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213

$1.827

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Argo Parts USA

USA . 6,801 parts In-Stock

1+ parts

$2.565

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-

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6,801

$2.565

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Continental Prestige Electronics

USA . 2,426 parts In-Stock

1+ parts

$2.565

100+ parts

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$2.514

2,426

$2.565

-

-

$2.514

Ampacity Inc.

Singapore . 26 parts In-Stock

1+ parts

$2.580

100+ parts

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26

$2.580

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Semicontronic

India . 13 parts In-Stock

1+ parts

$2.580

100+ parts

$2.516

1k+ parts

$2.503

10k+ parts

-

13

$2.580

$2.516

$2.503

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Corphita

USA . 3,714 parts In-Stock

1+ parts

$2.736

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3,714

$2.736

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Corohmni

South Africa . 636 parts In-Stock

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$3.040

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636

$3.040

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AZTECH Wire

Italy . 1,135 parts In-Stock

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$15.952

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$15.952

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QUARKTWIN TECHNOLOGY LTD

USA . 14,803 parts In-Stock

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TANS Electronics

Latvia . 11,240 parts In-Stock

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Kulean Microsystems

USA . 8,518 parts In-Stock

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8,518

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Problanco Electronics

Mexico . 6,428 parts In-Stock

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6,428

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SupplyDigital Components

Austria . 5,884 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$2.514

1k+ parts

$2.437

10k+ parts

$2.385

2,000

-

$2.514

$2.437

$2.385

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 710 parts In-Stock

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710

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Supply Digital

USA . 418 parts In-Stock

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418

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Microchip USA

USA . 333 parts In-Stock

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333

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Overview

Unleash the power of innovation with the FGH40N60SMDF-F085 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). Ideal for power control applications, this N-CHANNEL transistor offers a seamless performance with its built-in diode configuration. With a maximum operating temperature of 175°C and a collector-emitter voltage of 600V, this product guarantees efficiency and durability. Experience enhanced power dissipation and fast turn-off times with the FGH40N60SMDF-F085, making it the perfect choice for your high-power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliable performance and longevity.

Polarity or Channel Type: N-CHANNEL

Offers efficient power control capabilities, making it suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring excellent performance in controlling high power levels.

Maximum VCEsat: 2.5 V

Low VCEsat reduces power losses and improves overall efficiency of the transistor.

Package Shape: RECTANGULAR

Easy to mount and integrate into existing circuitry, providing versatility in installation.

Terminal Form: THROUGH-HOLE

Ensures secure connections and easy assembly onto circuit boards.

Maximum Fall Time (tf): 20 ns

Fast fall time allows for quick switching speeds, ideal for applications requiring rapid on/off transitions.

Nominal Turn Off Time (toff): 123 ns

Efficient turn-off time ensures minimal power dissipation and heat generation during operation.

No. of Terminals: 3

Simple and straightforward connection setup, reducing chances of errors during installation.

Maximum Power Dissipation (Abs): 349 W

High power dissipation capability makes it suitable for handling demanding power control tasks.

Package Style (Meter): FLANGE MOUNT

Secure and stable mounting option, ensuring reliability in various operating conditions.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without compromising performance or reliability.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltage levels, making it suitable for applications requiring high voltage switching.

Transistor Element Material: SILICON

Silicon-based transistor offers high performance and reliability, ensuring long-term operation.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage tolerance provides safety margin and protection against voltage spikes.

Minimum Operating Temperature: -55 °C

Capable of operating in low-temperature environments, suitable for a wide range of applications.

Maximum Collector Current (IC): 80 A

High collector current rating allows for handling heavy loads and high power levels.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low gate-emitter threshold voltage ensures efficient and reliable switching.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance, ensuring stable connections over time.

Terminal Position: SINGLE

Simple terminal configuration for easy installation and connection in a circuit.

Nominal Turn On Time (ton): 50 ns

Fast turn-on time ensures quick response and high-speed switching capability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N60SMDF-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

20 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

123 ns

Nominal Turn On Time (ton):

50 ns

Maximum VCEsat:

2.5 V

Trade Compliance

FGH40N60SMDF-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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