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F475R12KS4B11BOSA1

Infineon Technologies

F475R12KS4B11BOSA1 by Infineon Technologies

F475R12KS4B11BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 4 elements in a bridge configuration. It has a max collector-emitter voltage of 1200V and a nominal turn off time of 390ns, making it ideal for power control applications. The transistor is UL approved and features a built-in diode, thermistor, and isolated case connection for efficient performance.

Median Price

$196.105

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

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$196.105

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Vyrian

USA . 3,418 parts In-Stock

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Digiode

USA . 486 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,364 parts In-Stock

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$0.340

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$0.340

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Corohmni

South Africa . 403 parts In-Stock

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$0.984

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403

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Modulus Dynamics

Lithuania . 2,949 parts In-Stock

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$1.763

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$1.692

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$1.622

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2,949

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Microchip USA

USA . 3,501 parts In-Stock

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$6.396

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AZTECH Wire

Italy . 743 parts In-Stock

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$14.267

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Ampacity Inc.

Singapore . 1,106 parts In-Stock

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$25.050

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Semicontronic

India . 210 parts In-Stock

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$40.050

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$39.049

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$38.848

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210

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Continental Prestige Electronics

USA . 4,495 parts In-Stock

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$196.105

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$192.183

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Netroflash

USA . 2,000 parts In-Stock

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$196.105

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Corphita

USA . 974 parts In-Stock

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Argo Parts USA

USA . 343 parts In-Stock

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Overview

Looking for a powerful and reliable solution for your power control needs? Look no further than the F475R12KS4B11BOSA1 by Infineon Technologies. With its superior quality and advanced technology, this Insulated Gate Bipolar Transistor (IGBT) offers unmatched performance and efficiency. From industrial applications to renewable energy systems, this product provides exceptional value and benefits to customers seeking top-of-the-line power control solutions. Trust in Infineon Technologies to deliver the best in class products for all your power management needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower conduction losses and are more efficient than P-channel IGBTs, making them a good choice for power control applications.

Configuration: BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor help enhance the efficiency and reliability of the IGBT bridge configuration, making it suitable for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT is optimized for handling high currents and voltages efficiently.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and installation in various systems and configurations.

Maximum Collector-Emitter Voltage: 1200 V

High maximum collector-emitter voltage rating allows this IGBT to handle high voltage applications with ease.

Maximum Collector Current (IC): 100 A

High maximum collector current rating enables this IGBT to handle high current loads without overheating or failing prematurely.

Nominal Turn Off Time (toff): 390 ns

Fast turn off time helps in reducing switching losses and improving efficiency in power control applications.

Nominal Turn On Time (ton): 190 ns

Fast turn on time ensures quick switching speeds, making this IGBT suitable for high-frequency power control applications.

Reference Standard: UL APPROVED

UL approval ensures that this IGBT meets high safety and quality standards, making it a reliable choice for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) F475R12KS4B11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X24

No. of Elements:

4

No. of Terminals:

24

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

390 ns

Nominal Turn On Time (ton):

190 ns

Trade Compliance

F475R12KS4B11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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